M1AFS1500-1FGG256

The M1AFS1500-1FGG256 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, presented in a 256-LBGA package. It delivers a mid-range programmable logic resource with 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and 119 I/O pins for flexible digital design implementation.

Designed for commercial-grade surface-mount applications, the device supports a core supply range of 1.425 V to 1.575 V and operates between 0 °C and 85 °C. The package and feature set provide a balance of gate density, on-chip memory, and I/O count for integrated digital functions.

Key Features

• Logic Capacity  Approximately 38,400 logic elements and 1,500,000 gates to implement medium-complexity programmable logic and custom digital functions.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for local data storage, buffering, and state retention within logic designs.
• I/O Resources  119 general-purpose I/O pins to support multiple external interfaces, sensor links, and peripheral connections.
• Package Options  256-LBGA package (supplier device package: 256-FPBGA, 17 × 17) suitable for compact surface-mount assemblies.
• Power  Core supply voltage range from 1.425 V to 1.575 V to match common FPGA power architectures.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C for standard ambient environments.
• Mounting  Surface mount package compatible with modern PCB assembly processes.
• Compliance  RoHS compliant, meeting common environmental requirements for electronic assemblies.

Typical Applications

• Commercial Embedded Systems  Use the FPGA for programmable logic tasks that require a mix of logic elements, on-chip RAM, and multiple I/O lines within a commercial temperature range.
• Custom Interface and Glue Logic  Implement protocol bridging, custom I/O routing, and timing-critical interfacing using the 119 available I/O pins and programmable logic fabric.
• Prototyping and Design Iteration  Leverage the reprogrammable logic capacity and on-chip memory for rapid prototyping of medium-complexity digital functions and system validation.

Unique Advantages

• Balanced Logic Density:  38,400 logic elements and 1,500,000 gates provide a mid-range capacity that balances integration and cost for many commercial designs.
• On-Chip Memory:  Approximately 0.276 Mbits of embedded RAM reduces external memory needs for buffering and state machines, simplifying BOM and board layout.
• Generous I/O Count:  119 I/O pins enable multiple peripheral and interface connections without immediate need for external I/O expanders.
• Compact Package:  256-LBGA (17 × 17 FPBGA) offers a compact footprint for space-constrained PCBs while maintaining robust pin count.
• Commercial Temperature and RoHS Compliance:  0 °C to 85 °C operating range and RoHS compliance make the device suitable for standard commercial product deployments.
• Defined Power Range:  Specified core supply between 1.425 V and 1.575 V enables predictable power design and regulation selection.

Why Choose M1AFS1500-1FGG256?

The M1AFS1500-1FGG256 combines a mid-range logic fabric with on-chip memory and a substantial I/O complement in a compact 256-LBGA package. Its mix of 38,400 logic elements, approximately 0.276 Mbits of embedded RAM, and 119 I/O make it well suited to commercial embedded designs that require flexible, reconfigurable digital resources without moving to higher-density FPGA families.

With defined power and thermal ranges and RoHS compliance, this Fusion® FPGA is a practical choice for designers seeking a programmable logic device that integrates moderate logic, memory, and interface capacity into a surface-mount package from Microchip Technology.

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