M1AFS1500-1FGG256I

The M1AFS1500-1FGG256I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for programmable logic implementations requiring substantial logic capacity and I/O. This device provides 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and 119 user I/O in a 256-LBGA package.

With an industrial operating temperature range and a narrow core supply window, the device is suited to designs that need defined temperature and power-operating boundaries while maintaining a compact, surface-mount form factor.

Key Features

• Core & Logic Provides 1,500,000 gates and 38,400 logic elements to implement medium-density programmable logic designs.
• Embedded Memory Includes approximately 0.276 Mbits of on-chip RAM for buffer and state storage within logic designs.
• I/O & Package 119 available I/O pins are delivered in a 256‑LBGA package; supplier package noted as 256‑FPBGA (17×17) to support compact board layouts.
• Power Core supply operates between 1.425 V and 1.575 V, enabling consistent power budgeting for the FPGA core.
• Temperature & Grade Rated for an operating temperature range of -40°C to 100°C and specified as Industrial grade for environments matching that range.
• Mounting & Compliance Surface mount device with RoHS compliance for lead-free assembly processes.

Unique Advantages

• High logic density: 38,400 logic elements and 1.5M gates provide capacity for substantial programmable logic integration without increasing board count.
• On-chip memory: Approximately 0.276 Mbits of embedded RAM supports local buffering and state retention inside the FPGA fabric.
• Robust operating range: Industrial temperature rating from -40°C to 100°C supports deployment in temperature-variable environments.
• Compact BGA footprint with abundant I/O: 256‑LBGA (256‑FPBGA 17×17) package with 119 I/Os enables dense, space-efficient designs.
• Controlled core voltage: A defined supply range of 1.425 V to 1.575 V simplifies power-supply selection and verification.
• RoHS compliant: Meets lead-free assembly requirements for regulatory and manufacturing compatibility.

Why Choose M1AFS1500-1FGG256I?

The M1AFS1500-1FGG256I combines a substantial logic fabric, embedded memory, and a high I/O count in a compact 256‑LBGA package, making it a practical choice for engineers needing medium-density FPGA resources within an industrial temperature envelope. Its defined core voltage range and surface-mount packaging support consistent power and manufacturing workflows.

Manufactured by Microchip Technology, this Fusion® FPGA variant is positioned for designs where predictable thermal performance, a clear power profile, and a balance of logic capacity and I/O count are primary considerations.

Request a quote or contact sales to inquire about pricing, lead times, and availability for the M1AFS1500-1FGG256I.