M1AFS1500-1FGG484I

The M1AFS1500-1FGG484I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial-grade embedded logic applications. It provides a balance of mid-range logic capacity, on-chip memory, and a high I/O count in a compact 484-BGA package.

Targeted at industrial and embedded designs, this FPGA offers configurable hardware resources for control, signal processing, and I/O-dense implementations while supporting operation across a wide industrial temperature range.

Key Features

• Logic Capacity  Contains 38,400 logic elements for implementing custom digital functions and control logic.
• On-chip Memory  Approximately 0.276 Mbits of embedded memory (276,480 total RAM bits) to support buffers, state machines, and local data storage.
• Gate Density  About 1,500,000 gates to accommodate complex logic and glue-logic integration.
• I/O Resources  223 user I/O pins to support dense connectivity to external devices, sensors, and peripherals.
• Package and Mounting  484-FPBGA (23×23) package in a 484-BGA case, optimized for surface-mount PCB assembly and compact system footprints.
• Electrical  Core supply range of 1.425 V to 1.575 V to match platform power rails.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance  RoHS-compliant construction for environmental compliance in production builds.

Typical Applications

• Industrial Control  Programmable logic for factory automation, process controllers, and PLC-related glue logic where industrial temperature range and robust I/O are required.
• I/O-Dense Embedded Systems  High pin-count designs that require many external interfaces can benefit from the 223 user I/O connections.
• Signal Conditioning and Pre-Processing  Use embedded memory and logic elements to implement buffering, filtering, and preprocessing before passing data to downstream processors.
• Custom Control and Timing  Implement application-specific finite state machines, protocol handlers, and timing-critical logic within the FPGA fabric.

Unique Advantages

• High Logic Density:  38,400 logic elements provide the capacity to consolidate multiple discrete functions into a single programmable device.
• Significant On-Chip Memory:  Approximately 0.276 Mbits of embedded RAM supports local buffering and state retention without external memory.
• Ample I/O Count:  223 user I/O pins enable broad connectivity for sensors, actuators, and communication interfaces, reducing the need for external multiplexers.
• Industrial Reliability:  Rated for −40 °C to 100 °C operation and supplied in a durable BGA package suitable for industrial deployments.
• Compact, Surface-Mount Package:  484-FPBGA (23×23) package allows high-density PCB integration while keeping system footprint compact.
• Narrow Core Voltage Range:  Operates on a defined 1.425 V to 1.575 V supply to simplify power rail design and ensure stable core operation.

Why Choose M1AFS1500-1FGG484I?

The M1AFS1500-1FGG484I is positioned for engineers who need a mid-range FPGA with substantial logic capacity, embedded memory, and a high number of user I/Os in an industrial-grade package. Its combination of 38,400 logic elements, approximately 0.276 Mbits of on-chip RAM, and 223 I/Os makes it well suited for consolidating control, pre-processing, and interface functions into a single programmable device.

Designed for rugged environments, the device’s −40 °C to 100 °C rating and RoHS compliance provide predictable long-term operation in industrial systems. Choose this Fusion® FPGA when you need scalable programmable logic, dense connectivity, and a compact BGA footprint for industrial embedded designs.

Request a quote or submit an inquiry for pricing and availability to begin integrating the M1AFS1500-1FGG484I into your design.