M1AFS1500-1FGG676

The M1AFS1500-1FGG676 is a Fusion® field programmable gate array (FPGA) from Microchip Technology designed for commercial embedded designs that require programmable logic and flexible I/O. It delivers mid-range logic capacity and on-chip memory in a compact ball-grid array package suitable for surface-mount assembly.

Key Features

• Logic Capacity — 38,400 logic elements providing programmable resources for custom digital functions and signal processing.
• Gate Count — Approximately 1,500,000 gates to support complex logic implementations.
• Embedded Memory — Approximately 0.276 Mbits of embedded memory (276,480 bits) for data buffering and state storage.
• I/O — 252 user I/O pins for interfacing to peripherals, sensors, and external logic.
• Package — 676-ball BGA (supplier package: 676-FBGA, 27×27) optimized for high pin-count, space-efficient board designs; surface-mount mounting type.
• Power — Core supply voltage range 1.425 V to 1.575 V to match target power-rail designs.
• Temperature Range — Commercial grade operation from 0 °C to 85 °C for standard commercial applications.
• Compliance — RoHS compliant to meet common environmental requirements.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and data-path functions within OEM products and embedded controllers.
• Protocol Bridging and I/O Expansion — Create custom interfaces and translate signals between subsystems using available I/O and programmable logic.
• Prototyping and Development — Validate digital designs and iterate hardware logic in development platforms requiring substantial logic and I/O density.

Unique Advantages

• High Logic Density: 38,400 logic elements enable substantial on-chip programmable resources without moving to larger packages.
• Significant Gate Count: Approximately 1.5 million gates support complex state machines and data-processing pipelines.
• Embedded Memory Availability: Approximately 0.276 Mbits of on-chip RAM reduces external memory dependency for many control and buffering tasks.
• Generous I/O Count: 252 I/O pins provide flexibility for multi-interface designs and peripheral connectivity.
• Compact, High-Pin Package: 676-FBGA (27×27) offers a high pin count in a compact, surface-mount form factor suitable for space-constrained boards.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C operation to match standard commercial product requirements.

Why Choose M1AFS1500-1FGG676?

The M1AFS1500-1FGG676 combines substantial programmable logic, embedded memory, and a high I/O count in a compact 676-ball BGA package, making it well suited for commercial embedded designs that require scalable digital integration. Its defined supply voltage range and commercial temperature rating provide predictable electrical and environmental characteristics for production designs.

Designed by Microchip Technology, this FPGA offers a balance of logic capacity and connectivity for engineers building custom digital functions, protocol converters, or prototype systems while maintaining compliance with RoHS requirements.

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