M1AFS1500-2FG256I

The M1AFS1500-2FG256I is a Fusion® Field Programmable Gate Array from Microchip Technology providing a balanced mid-density logic fabric. It delivers 38,400 logic elements (CLBs), approximately 0.276 Mbits of embedded memory, and 1,500,000 gates to implement configurable logic and interfacing functions.

With 119 user I/Os, a compact 256-LBGA package (256-FPBGA, 17 × 17), industrial-grade qualification, and a nominal core supply range of 1.425 V to 1.575 V, this device is targeted at embedded and industrial applications that require reliable, reprogrammable logic in a space-efficient surface-mount package.

Key Features

• Core Logic 38,400 logic elements provide a mid-density programmable fabric capable of implementing custom digital logic and control functions.
• On-chip Memory Approximately 0.276 Mbits of embedded RAM (276,480 bits) for buffering, state storage, and algorithm acceleration.
• Gate Count 1,500,000 gates for mapping complex logic and glue functions within integrated designs.
• I/O Capability 119 user I/Os support broad interfacing needs for sensors, peripherals, and external logic.
• Power Core voltage supply range of 1.425 V to 1.575 V to match system power domains requiring a low-voltage core.
• Package & Mounting 256-LBGA (256-FPBGA, 17 × 17) surface-mount package enables compact board-level integration.
• Temperature & Grade Industrial grade with an operating range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance RoHS compliant for adherence to common environmental requirements.

Typical Applications

• Industrial Control Use the device's industrial temperature rating and 119 I/Os to implement control logic, I/O aggregation, and real-time interface tasks in factory or process automation equipment.
• Embedded System Glue Logic Leverage 38,400 logic elements and 1.5M gates to consolidate discrete glue logic, protocol bridging, and custom peripheral handling on a single FPGA.
• Communications Interfaces The ample I/O count and on-chip RAM make the FPGA suitable for implementing interface converters, buffering, and deterministic packet handling functions.
• Custom Control and Monitoring Combine the device’s logic, memory, and I/O resources to create tailored monitoring, sensor aggregation, and control subsystems within compact packages.

Unique Advantages

• Balanced Logic and Memory: 38,400 logic elements paired with approximately 0.276 Mbits of RAM provide a practical mix for mid-range designs that need both combinational logic and embedded storage.
• Compact, High-Lead-Count Package: The 256-LBGA (17 × 17) footprint enables high I/O density in a small PCB area, reducing board-level complexity.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation to support deployments in harsh or variable-temperature environments.
• Low-Voltage Core Compatibility: A defined supply window of 1.425 V to 1.575 V simplifies integration into systems using low-voltage power rails.
• RoHS Compliant: Meets common environmental material directives for regulated markets and product lines.
• Surface-Mount Integration: Designed for standard surface-mount assembly processes to support modern production flow and automated PCB assembly.

Why Choose M1AFS1500-2FG256I?

The M1AFS1500-2FG256I positions itself as a flexible, industrial-grade FPGA option for designers who need a mid-density programmable device with a strong mix of logic, gates, I/O, and embedded memory. Its 256-LBGA package and surface-mount mounting make it suitable for space-constrained PCBs while maintaining substantial I/O connectivity.

Backed by Microchip Technology, this Fusion® FPGA suits teams building robust embedded systems, industrial control modules, and custom interface logic that require predictable operating ranges, RoHS compliance, and a compact form factor.

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