M1AFS1500-2FG676I

The M1AFS1500-2FG676I is a Fusion® field programmable gate array (FPGA) from Microchip Technology, providing a balance of logic capacity, I/O density and programmable memory for industrial applications. With 38,400 logic elements, roughly 0.28 Mbits of embedded memory and 252 user I/O, this device is intended for designs that require significant on-chip logic and flexible I/O in a compact BGA package.

Industrial-grade temperature range and a narrow core supply window make the device suitable for deployed systems where controlled operating conditions and long-term availability are priorities.

Key Features

• Core Logic 38,400 logic elements and approximately 1,500,000 gates provide substantial programmable logic capacity for custom digital designs.
• Embedded Memory Approximately 0.28 Mbits of on-chip RAM for user data buffering and small lookup-table storage.
• I/O Density 252 general-purpose I/O pins support high pin-count interfacing and parallel I/O requirements.
• Power Specified core voltage supply range of 1.425 V to 1.575 V to match board-level power planning and regulator selection.
• Package and Mounting 676-ball BGA package (supplier package: 676-FBGA, 27×27 mm) optimized for surface-mount assembly and compact PCB layouts.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for use in industrial environments.
• RoHS Compliant Meets RoHS environmental requirements for lead-free assemblies.

Typical Applications

• Industrial Control and Automation — Implement custom logic, sensor interfacing and I/O aggregation for factory floor controllers and embedded motion systems.
• Communications and Data Aggregation — Provide programmable protocol handling and parallel I/O for data concentrators and network interface modules.
• Custom Embedded Processing — Offload application-specific processing or create glue logic between processors and peripherals in compact, surface-mount designs.

Unique Advantages

• High Logic Capacity: 38,400 logic elements and 1,500,000 gates enable complex custom logic implementations without external PLD resources.
• Generous I/O Count: 252 I/O pins reduce the need for additional I/O expanders and simplify board-level integration.
• Compact BGA Packaging: 676-ball FBGA (27×27) balances high pin count with a small PCB footprint for space-constrained systems.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in a wide range of industrial environments.
• Controlled Core Supply: Narrow voltage window (1.425 V–1.575 V) for predictable power design and stable core operation.
• RoHS Compliance: Facilitates use in lead-free manufacturing flows and regulatory-aligned products.

Why Choose M1AFS1500-2FG676I?

The M1AFS1500-2FG676I positions itself as a robust, industrial-grade FPGA option for designs that require a substantial number of logic elements, a high I/O count and on-chip RAM in a compact BGA package. Its combination of programmable capacity and defined electrical and thermal limits makes it suitable for engineers building deployed embedded systems that need predictable performance and integration.

This device is well suited to customers who need scalable, vendor-backed FPGA silicon for industrial control, communications front-ends or custom embedded processing tasks where board real estate, I/O density and temperature range are key considerations.

Request a quote or submit an inquiry to get pricing and availability for the M1AFS1500-2FG676I. Our team can provide ordering details and support for your design requirements.