M1AFS1500-2FGG484
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 223 276480 484-BGA |
|---|---|
| Quantity | 493 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 223 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1AFS1500-2FGG484 – Fusion® Field Programmable Gate Array (FPGA) 484-BGA
The M1AFS1500-2FGG484 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology provided in a 484-BGA (484-FPBGA, 23×23) surface-mount package. It delivers a balanced combination of programmable logic, embedded memory and a substantial I/O complement for commercial electronic designs.
With 38,400 logic elements, approximately 0.276 Mbits (276,480 bits) of on-chip RAM and 223 I/O pins, this device is suited to commercial applications requiring moderate logic capacity, significant I/O connectivity and a controlled supply/temperature operating window.
Key Features
- Core Logic 38,400 logic elements (cells) and approximately 1,500,000 gates provide the programmable fabric for custom logic implementation.
- Embedded Memory Approximately 0.276 Mbits (276,480 bits) of on-chip RAM supports data buffering, state storage and small lookup tables.
- I/O Capacity 223 I/O pins offer broad external connectivity for interfacing with peripherals, sensors and other digital subsystems.
- Package & Mounting 484-BGA package (supplier package 484-FPBGA, 23×23) in a surface-mount form factor enables compact board integration.
- Power Single-supply operation within a specified range of 1.425 V to 1.575 V for predictable power planning.
- Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Environmental Compliance RoHS compliant to support regulatory requirements for commercial electronics.
Typical Applications
- Custom Logic & Prototyping — Implement and validate custom digital functions using the device’s 38,400 logic elements and on-chip RAM.
- Interface Bridging & Signal Aggregation — Use 223 I/O pins to consolidate and translate signals between subsystems in compact commercial designs.
- Embedded Control in Commercial Products — Deploy control and coordination logic within the 0 °C to 85 °C operating range for consumer and commercial electronics.
- High-Density Board Designs — Leverage the 484-BGA (23×23) package for space-constrained PCBs requiring substantial logic and I/O capacity.
Unique Advantages
- Substantial Logic Capacity: 38,400 logic elements enable complex combinational and sequential designs without external CPLDs or additional logic ICs.
- Integrated On-Chip RAM: Approximately 0.276 Mbits of embedded memory reduces the need for external SRAM for small data buffering and state storage.
- Extensive I/O Count: 223 I/O pins simplify system integration by supporting many interfaces and peripherals directly on-chip.
- Compact BGA Footprint: 484-BGA (484-FPBGA, 23×23) packaging provides a high-density solution for space-limited boards while supporting surface-mount assembly.
- Controlled Supply Range: Defined 1.425 V to 1.575 V supply requirement assists in precise power-supply design and margining.
- Commercial-Grade and RoHS Compliant: Rated for 0 °C to 85 °C and RoHS compliant to meet standard commercial product requirements.
Why Choose M1AFS1500-2FGG484?
The M1AFS1500-2FGG484 positions itself as a commercially graded Fusion® FPGA option for designs that need a balanced mix of programmable logic, embedded memory and abundant I/O in a compact BGA package. Its defined supply and temperature ranges, combined with RoHS compliance and Microchip Technology manufacturing, make it suitable for commercial electronic systems requiring predictable electrical and environmental characteristics.
This device is ideal for engineers and product teams implementing medium-complexity logic, interface aggregation or embedded control functions where board space, I/O count and integrated memory are key considerations.
Request a quote or submit an inquiry to purchase the M1AFS1500-2FGG484 and discuss pricing and availability for your design requirements.

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