M1AFS1500-2FGG676

The M1AFS1500-2FGG676 is a Fusion® Field Programmable Gate Array supplied in a 676-BGA (676-FBGA, 27×27) surface-mount package. It provides a high-density programmable logic resource with 38,400 logic elements, 1,500,000 gates and 252 user I/O pins.

Designed for engineers who need configurable logic with significant I/O and on-chip memory, this commercial-grade device operates from a 1.425 V to 1.575 V supply and across a 0 °C to 85 °C operating range, offering a compact packaged solution for a range of embedded applications.

Key Features

• Core Logic  Provides 38,400 logic elements and approximately 1,500,000 gates to implement complex programmable logic functions.
• Embedded Memory  Includes approximately 0.276 Mbits of on-chip RAM (276,480 total RAM bits) for buffering, state storage, and local data handling.
• I/O Density  252 user I/O pins support a wide variety of external interfaces and board-level connections.
• Package & Mounting  Delivered in a 676-BGA package (supplier package: 676-FBGA, 27×27) for surface-mount assembly and high pin-count routing.
• Power  Operates from a narrow core supply range of 1.425 V to 1.575 V to match tight system power rails.
• Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C, suitable for commercial electronic applications.
• Regulatory  RoHS compliant for lead-free, environmentally conscious design requirements.

Typical Applications

• Interface and I/O Bridging  Use the device’s 252 I/Os and programmable logic resources to implement custom interface translation and board-level protocol bridging.
• Embedded Control Logic  Deploy logic elements and on-chip RAM for deterministic control functions and finite-state machines in embedded systems.
• Prototyping and Development  Leverage the high logic density and configurable I/O for hardware prototyping and proof-of-concept designs.

Unique Advantages

• High Logic Density: 38,400 logic elements and 1,500,000 gates provide the capacity to implement substantial custom logic within a single device.
• Compact High-Pin Package: 676-BGA (27×27) packaging delivers large I/O count in a compact footprint, simplifying board-level integration where space is limited.
• On-Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces dependence on external memory for local buffering and state storage.
• Controlled Power Envelope: Narrow supply range (1.425 V–1.575 V) enables predictable power planning and integration with regulated power systems.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C, matching typical commercial electronics deployment conditions.
• RoHS Compliant: Supports lead-free manufacturing and regulatory compliance for modern electronics production.

Why Choose M1AFS1500-2FGG676?

The M1AFS1500-2FGG676 positions itself as a high-capacity, commercially rated FPGA option for designs that require substantial programmable logic, a large number of I/Os, and on-chip memory in a single-package solution. Its 676-BGA package and surface-mount format make it suitable for dense board layouts where pin count and signal routing are priorities.

This part is well suited to engineers building configurable logic into embedded systems, interface conversion modules, and hardware prototypes who need a balance of logic capacity, memory, and a predictable power and thermal envelope backed by RoHS compliance.

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