M1AFS1500-2FGG484I

The M1AFS1500-2FGG484I is a Fusion® Field Programmable Gate Array (FPGA) IC offering a balanced combination of logic density, embedded memory, and flexible I/O in a compact 484-ball BGA package. With 38,400 logic elements and approximately 0.276 Mbits of on-chip RAM, this industrial-grade device is intended for designs that require programmable logic, significant I/O count, and operation across a wide temperature range.

Key Features

• Core Logic  Approximately 1,500,000 gates implemented across 38,400 logic elements, providing sizable logic capacity for custom digital functions and control logic.
• Embedded Memory  Approximately 276,480 bits (≈0.276 Mbits) of on-chip RAM for buffering, state storage, and small data structures.
• I/O  223 I/O pins to support multiple external interfaces, sensors, and peripheral connections in a single device.
• Power  Nominal core voltage range of 1.425 V to 1.575 V to match targeted supply domains and power profiles.
• Package and Mounting  484-ball FPBGA (484-BGA) package, 23×23 format, designed for surface-mount assembly to enable compact board layouts.
• Operating Range  Industrial-grade qualification with an operating temperature from -40°C to 100°C for reliable performance in demanding environments.
• Compliance  RoHS-compliant manufacturing to support regulatory and environmental requirements.

Typical Applications

• Industrial Control Systems  Used in embedded controllers and automation equipment where industrial-grade temperature range and programmable logic enable custom control functions.
• Custom I/O and Interface Bridging  Supports designs that require a high I/O count for protocol conversion, sensor aggregation, or custom peripheral interfacing.
• Embedded Prototyping and Development  Provides a programmable platform for developing and validating digital logic, state machines, and small memory-dependent algorithms.

Unique Advantages

• Highly integrated logic capacity: 1,500,000 gates and 38,400 logic elements reduce the need for multiple discrete devices and simplify system architecture.
• Substantial I/O capability: 223 I/Os allow consolidation of multiple interfaces and peripherals onto a single FPGA, lowering BOM complexity.
• Industrial temperature rating: Specified operation from -40°C to 100°C supports deployment in harsh and temperature-variable environments.
• Compact BGA footprint: 484-ball FPBGA (23×23) package enables dense PCB layouts while maintaining high pin count.
• Low-voltage core operation: Defined supply range (1.425 V–1.575 V) for predictable power integration with contemporary supply rails.
• RoHS compliant: Environmentally compliant manufacturing reduces regulatory risk for end products.

Why Choose M1AFS1500-2FGG484I?

The M1AFS1500-2FGG484I positions itself as a robust, industrial-grade FPGA option for engineers who need significant logic density, a high I/O count, and on-chip memory in a compact BGA package. Its specified voltage range and wide operating temperature make it suitable for rugged embedded systems and control applications.

This device is well suited for teams building custom digital interfaces, consolidating multiple functions into a single programmable device, or developing prototypes that will transition to industrial deployments. Its combination of logic elements, embedded RAM, and I/O flexibility delivers long-term value through design consolidation and predictable electrical and thermal characteristics.

Request a quote or submit an inquiry to get pricing and availability for the M1AFS1500-2FGG484I and support for integrating this Fusion® FPGA into your next design.