M1AFS1500-FG256

The M1AFS1500-FG256 is a Fusion® Field Programmable Gate Array (FPGA) provided in a 256-LBGA package. It delivers a mid-range programmable logic resource set with defined I/O, on-chip memory and a compact surface-mount package targeted for commercial electronic designs.

With 38,400 logic elements, approximately 0.28 Mbits of embedded memory and 119 user I/O, this device is intended for commercial applications that require integrated programmable logic with controlled power and temperature characteristics.

Key Features

• Core Logic — 38,400 logic elements (cells) providing a programmable fabric for implementing custom logic and control functions.
• On-Chip Memory — Approximately 0.28 Mbits of embedded RAM (276,480 total RAM bits) to support buffering, small data tables and state storage.
• I/O Count — 119 user I/O pins to interface with peripherals, sensors, and external logic.
• Gate Count — 1,500,000 gates enabling moderate-complexity designs where density and integration matter.
• Power — Specified core supply range of 1.425 V to 1.575 V for predictable power budgeting and system integration.
• Package and Mounting — 256-LBGA surface-mount package (supplier package: 256-FPBGA, 17×17) for compact board layouts.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operation, suitable for standard commercial environments.
• Regulatory — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement custom logic and control functions within commercial products requiring programmable logic and moderate I/O counts.
• Prototyping and Development — Evaluate mid-range logic architectures and integration approaches in development platforms and proof-of-concept boards.
• Interface and Glue Logic — Consolidate discrete logic and intermediate interface functions into a single programmable device to reduce component count and PCB complexity.

Unique Advantages

• Significant Logic Capacity: 38,400 logic elements provide substantial headroom for implementing complex state machines and custom datapaths.
• On-Device Memory: Approximately 0.28 Mbits of embedded RAM reduces dependency on external memory for buffering and small tables.
• Generous I/O: 119 I/O pins allow flexible interfacing to a wide range of peripherals and external devices.
• Compact, Surface-Mount Package: 256-LBGA (17×17) helps minimize PCB footprint while supporting reliable board-level assembly.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns with standard commercial product requirements.
• RoHS Compliance: Meets RoHS requirements for lead-free manufacturing and assembly processes.

Why Choose M1AFS1500-FG256?

The M1AFS1500-FG256 positions itself as a mid-range Fusion® FPGA solution balancing programmable logic density, embedded memory and I/O capacity in a compact 256-LBGA package. Its combination of 38,400 logic elements, 119 I/O and approximately 0.28 Mbits of RAM makes it suitable for commercial designs that require integrated, configurable logic without adding external glue components.

Choose this device when you need a commercially rated FPGA that offers measurable logic and memory resources, straightforward power requirements, and a compact package for space-constrained boards. It provides a pragmatic platform for developers and designers seeking predictable integration and RoHS-compliant manufacturing.

Request a quote or contact sales to discuss availability, pricing and how M1AFS1500-FG256 can fit your design requirements.