M1AFS1500-2FGG676I

The M1AFS1500-2FGG676I is a Fusion® Field Programmable Gate Array (FPGA) designed for industrial-grade embedded systems. It combines a high logic element count with on-chip memory and a substantial I/O complement for mid-density programmable logic implementations.

With 38,400 logic elements and approximately 0.276 Mbits of embedded memory, this surface-mount 676-BGA device targets applications requiring compact, reconfigurable logic, predictable supply requirements, and operation across a wide industrial temperature range.

Key Features

• Logic Capacity — 38,400 logic elements (equivalent to the specified logic cells) supporting up to 1,500,000 gates for mid-density logic integration.
• Embedded Memory — Approximately 0.276 Mbits of on-chip RAM to support buffering, state retention, and small data structures close to the logic.
• I/O Resources — 252 user I/O pins to interface with peripherals, sensors, and external logic devices.
• Voltage Supply — Operates from 1.425 V to 1.575 V, enabling designs with defined core-voltage requirements.
• Package and Mounting — 676-BGA (supplier package: 676-FBGA, 27×27) in a surface-mount package for compact board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance — RoHS compliant, supporting regulatory requirements for restricted substances.

Typical Applications

• Industrial Control — Implement real-time control logic and interface functions in industrial automation systems, taking advantage of the device’s industrial temperature rating and sizeable I/O count.
• Embedded Processing — Integrate mid-density custom logic and local memory for protocol handling, data buffering, or pre-processing in embedded products.
• Sensor and Instrumentation Interfaces — Aggregate and condition signals from multiple sensors using the available I/O and on-chip memory for short-term data storage.
• Communication Gateways — Implement custom bridging or protocol translation logic where a compact BGA package and moderate logic density are required.

Unique Advantages

• High Logic Density: 38,400 logic elements and 1.5 million gates enable substantial programmable functionality in a single device.
• On-Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Ample I/O: 252 I/O pins provide flexibility for multi-channel interfacing and peripheral connectivity.
• Industrial Reliability: Rated from −40 °C to 100 °C to meet demanding environmental requirements in industrial deployments.
• Compact Packaging: 676-BGA (676-FBGA, 27×27) surface-mount package supports space-constrained board designs while keeping a high pin count.
• Standards Compliance: RoHS compliance supports regulatory and manufacturing requirements for restricted substances.

Why Choose M1AFS1500-2FGG676I?

The M1AFS1500-2FGG676I delivers a balanced combination of programmable logic capacity, embedded memory, and a large I/O complement in a compact 676-BGA package. Its industrial temperature rating and defined supply range make it suitable for embedded and industrial applications that need reliable, reconfigurable logic close to the system I/O.

This device is well suited for engineers and system designers building mid-density FPGA-based solutions that require integration of control, interfacing, and buffering functions without expanding board footprint. Its RoHS compliance and surface-mount BGA package support modern manufacturing and regulatory needs.

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