M1AFS1500-2FGG256I

The M1AFS1500-2FGG256I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-grade embedded applications. It delivers a balance of logic density, on-chip memory, and I/O capacity in a compact 256-LBGA package for surface-mount assembly.

With 38,400 logic elements and approximately 0.276 Mbits of embedded memory, this device targets designs that require programmable logic, flexible I/O, and operation across a wide industrial temperature range.

Key Features

• Logic Core 38,400 logic elements (also listed as CLBs) and 1,500,000 gates provide substantial programmable logic capacity for custom digital designs.
• Embedded Memory Approximately 0.276 Mbits of on-chip RAM (276,480 total RAM bits) for data buffering, state machines, and small lookup tables.
• I/O Capacity 119 general-purpose I/O pins to support a variety of external interfaces and peripheral connections.
• Power Operates from a core supply voltage range of 1.425 V to 1.575 V to match system power delivery requirements.
• Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
• Compliance RoHS compliant.

Typical Applications

• Industrial embedded systems — Programmable logic for industrial control and monitoring where industrial-grade temperature range is required.
• Custom digital logic — Implement protocol adaptations, glue logic, and bespoke processing pipelines using the device’s logic elements and on-chip RAM.
• I/O-centric designs — Systems requiring numerous external connections can leverage the 119 I/O pins for sensors, peripherals, and interface bridging.
• Compact board-level solutions — The 256-LBGA (256-FPBGA, 17×17) package enables dense, surface-mount PCB layouts.

Unique Advantages

• High logic density: 38,400 logic elements and 1,500,000 gates allow integration of complex logic into a single device, reducing BOM and board area.
• On-chip memory for control and buffering: Approximately 0.276 Mbits of embedded RAM supports state storage and small data buffers without external memory.
• Generous I/O count: 119 I/O pins enable flexible interfacing to multiple external components and subsystems.
• Industrial readiness: Rated for −40 °C to 100 °C operation and supplied in a surface-mount BGA package suitable for industrial applications.
• Compact package: 256-LBGA / 256-FPBGA (17×17) provides a space-efficient solution for dense boards.
• Regulatory compliance: RoHS compliant for environmental and manufacturing compatibility.

Why Choose M1AFS1500-2FGG256I?

The M1AFS1500-2FGG256I positions itself as a capable, industrial-grade FPGA option for designers needing a solid balance of logic resources, on-chip memory, and I/O in a compact package. Its specified operating voltage range and industrial temperature rating make it suitable for embedded applications that demand reliable operation across a wide thermal range.

Engineers and procurement teams looking for a Fusion® FPGA with sizable logic capacity, moderate embedded memory, and extensive I/O will find this part suitable for consolidating custom digital functions, reducing external component count, and enabling compact PCB implementations.

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