M1AFS1500-2FG484I
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 223 276480 484-BGA |
|---|---|
| Quantity | 458 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 223 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1AFS1500-2FG484I – Fusion® Field Programmable Gate Array (FPGA) IC 223 276480 484-BGA
The M1AFS1500-2FG484I is a Fusion® field programmable gate array from Microchip Technology offering a high-density logic fabric with substantial on-chip memory and I/O capability. Delivered in a 484-FPBGA (23×23) surface-mount package, this industrial-grade FPGA targets designs that require a compact, resource-rich programmable logic device.
Key device resources include 38,400 logic elements, approximately 0.276 Mbits of embedded memory, support for up to 223 I/O pins, and a core voltage range of 1.425 V to 1.575 V. The device is specified for operation from -40 °C to 100 °C and is RoHS compliant.
Key Features
- Logic Capacity 38,400 logic elements provide substantial on-chip programmable logic for implementing complex custom functions and state machines.
- Embedded Memory Approximately 0.276 Mbits of on-chip RAM (276,480 total bits) for buffers, FIFOs, and small data storage requirements.
- I/O Count Up to 223 I/O pins to support multiple interfaces and external device connectivity in a single device.
- Gate Count Approximately 1,500,000 gates for broad design flexibility across control, signal processing, and glue-logic tasks.
- Package & Mounting 484-FPBGA (23×23) package in a 484-BGA case; surface-mount mounting for compact PCB integration.
- Power Core supply range from 1.425 V to 1.575 V to match system power rails and design requirements.
- Operating Range & Grade Industrial grade with an operating temperature span of -40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Systems Leverages the industrial temperature rating and robust I/O count to implement control logic, monitoring, and interface functions in industrial equipment.
- Embedded Systems and Custom Logic Provides the logic density and on-chip memory needed for custom processing, protocol implementation, and glue logic in embedded designs.
- I/O Aggregation and Interface Bridging High I/O availability enables consolidation of multiple interfaces or signal routing tasks into a single FPGA package.
Unique Advantages
- High Logic Density: 38,400 logic elements deliver ample capacity for complex finite-state machines, custom datapaths, and peripheral integration.
- Integrated Memory: Approximately 0.276 Mbits of embedded RAM reduces external memory needs for small buffers and on-chip data storage.
- Large I/O Count in a Compact Package: 223 I/O pins in a 484-FPBGA (23×23) footprint enable feature-rich designs while conserving PCB area.
- Industrial Temperature Range: Rated for -40 °C to 100 °C to support deployments in temperature-challenging environments.
- Controlled Core Voltage: Narrow supply window (1.425 V to 1.575 V) simplifies power supply design for core logic.
- RoHS Compliant: Meets environmental compliance requirements for a wide range of product programs.
Why Choose M1AFS1500-2FG484I?
The M1AFS1500-2FG484I combines a high logic element count, measurable on-chip memory, and a large number of I/O pins in a compact 484-FPBGA package, making it suitable for designers who need concentrated programmable resources in industrial applications. Its operating temperature range and RoHS compliance support deployment in regulated and temperature-variable environments.
Designed and manufactured by Microchip Technology, this Fusion® FPGA is positioned for projects that require a balance of integration, I/O capability, and predictable electrical and thermal characteristics. A detailed datasheet is available from the manufacturer for system-level design and integration.
Request a quote or submit a product inquiry to obtain pricing, availability, and ordering information for the M1AFS1500-2FG484I.

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