M1AFS1500-2FG484I

IC FPGA 223 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 223 276480 484-BGA

Quantity 458 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O223Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of M1AFS1500-2FG484I – Fusion® Field Programmable Gate Array (FPGA) IC 223 276480 484-BGA

The M1AFS1500-2FG484I is a Fusion® field programmable gate array from Microchip Technology offering a high-density logic fabric with substantial on-chip memory and I/O capability. Delivered in a 484-FPBGA (23×23) surface-mount package, this industrial-grade FPGA targets designs that require a compact, resource-rich programmable logic device.

Key device resources include 38,400 logic elements, approximately 0.276 Mbits of embedded memory, support for up to 223 I/O pins, and a core voltage range of 1.425 V to 1.575 V. The device is specified for operation from -40 °C to 100 °C and is RoHS compliant.

Key Features

  • Logic Capacity  38,400 logic elements provide substantial on-chip programmable logic for implementing complex custom functions and state machines.
  • Embedded Memory  Approximately 0.276 Mbits of on-chip RAM (276,480 total bits) for buffers, FIFOs, and small data storage requirements.
  • I/O Count  Up to 223 I/O pins to support multiple interfaces and external device connectivity in a single device.
  • Gate Count  Approximately 1,500,000 gates for broad design flexibility across control, signal processing, and glue-logic tasks.
  • Package & Mounting  484-FPBGA (23×23) package in a 484-BGA case; surface-mount mounting for compact PCB integration.
  • Power  Core supply range from 1.425 V to 1.575 V to match system power rails and design requirements.
  • Operating Range & Grade  Industrial grade with an operating temperature span of -40 °C to 100 °C for deployment in demanding environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Industrial Control Systems  Leverages the industrial temperature rating and robust I/O count to implement control logic, monitoring, and interface functions in industrial equipment.
  • Embedded Systems and Custom Logic  Provides the logic density and on-chip memory needed for custom processing, protocol implementation, and glue logic in embedded designs.
  • I/O Aggregation and Interface Bridging  High I/O availability enables consolidation of multiple interfaces or signal routing tasks into a single FPGA package.

Unique Advantages

  • High Logic Density: 38,400 logic elements deliver ample capacity for complex finite-state machines, custom datapaths, and peripheral integration.
  • Integrated Memory: Approximately 0.276 Mbits of embedded RAM reduces external memory needs for small buffers and on-chip data storage.
  • Large I/O Count in a Compact Package: 223 I/O pins in a 484-FPBGA (23×23) footprint enable feature-rich designs while conserving PCB area.
  • Industrial Temperature Range: Rated for -40 °C to 100 °C to support deployments in temperature-challenging environments.
  • Controlled Core Voltage: Narrow supply window (1.425 V to 1.575 V) simplifies power supply design for core logic.
  • RoHS Compliant: Meets environmental compliance requirements for a wide range of product programs.

Why Choose M1AFS1500-2FG484I?

The M1AFS1500-2FG484I combines a high logic element count, measurable on-chip memory, and a large number of I/O pins in a compact 484-FPBGA package, making it suitable for designers who need concentrated programmable resources in industrial applications. Its operating temperature range and RoHS compliance support deployment in regulated and temperature-variable environments.

Designed and manufactured by Microchip Technology, this Fusion® FPGA is positioned for projects that require a balance of integration, I/O capability, and predictable electrical and thermal characteristics. A detailed datasheet is available from the manufacturer for system-level design and integration.

Request a quote or submit a product inquiry to obtain pricing, availability, and ordering information for the M1AFS1500-2FG484I.

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