M1AFS1500-2FGG256
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 119 276480 256-LBGA |
|---|---|
| Quantity | 217 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 119 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1AFS1500-2FGG256 – Fusion® FPGA, 1,500,000 gates, 256-LBGA
The M1AFS1500-2FGG256 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology. It integrates 1,500,000 gates, 38,400 logic elements and approximately 0.276 Mbits of embedded memory with 119 user I/O pins in a 256-LBGA package.
Designed for commercial-grade applications, this surface-mount FPGA operates from 1.425 V to 1.575 V and across an operating temperature range of 0 °C to 85 °C, providing a compact, programmable logic option for a variety of electronic systems.
Key Features
- Core Logic Density 38,400 logic elements deliver significant programmable logic resources for complex combinational and sequential designs.
- Gate Count 1,500,000 gates provide a measure of device capacity for integrating multiple functions on a single FPGA.
- On-chip Memory Approximately 0.276 Mbits of embedded RAM for local data buffering and state storage within custom logic.
- I/O 119 I/O pins to support a broad mix of peripheral interfaces and board-level connectivity requirements.
- Power Operates from a core supply range of 1.425 V to 1.575 V, enabling consistent integration with targeted system power rails.
- Package & Mounting Supplied in a 256-LBGA (256-FPBGA, 17 × 17) surface-mount package for compact PCB integration and standardized assembly.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation to match commercial electronics deployment environments.
- Environmental Compliance RoHS-compliant to meet standard environmental and manufacturing requirements.
Typical Applications
- Commercial electronics — Implement custom logic and peripheral control in commercially graded electronic equipment where programmable capacity and I/O density are required.
- Prototyping and development — Use the FPGA’s logic and embedded memory resources for hardware validation and design iteration on surface-mount evaluation boards.
- Communications and interface bridging — Provide protocol adaptation and interface glue logic using available I/O and logic elements within the 256-LBGA footprint.
Unique Advantages
- High logic capacity: 1,500,000 gates and 38,400 logic elements allow integration of multiple functions that would otherwise require additional devices.
- Compact packaging: 256-LBGA (17 × 17) minimizes board area while keeping a substantial number of I/Os accessible for system design.
- Balanced I/O complement: 119 pins provide flexibility for connecting peripherals, sensors, and external memory or logic.
- Commercial-grade operating range: 0 °C to 85 °C rating aligns with typical commercial deployments and assembly processes.
- RoHS-compliant: Meets common environmental manufacturing standards for streamlined production compliance.
- Predictable power window: Defined supply range of 1.425 V to 1.575 V supports straightforward power-supply design and integration.
Why Choose M1AFS1500-2FGG256?
The M1AFS1500-2FGG256 positions itself as a commercial-grade, highly programmable solution that combines substantial logic resources, on-chip memory, and a broad I/O count in a compact 256-LBGA package. Its defined core voltage range and commercial temperature rating make it suitable for a wide range of electronic product designs that require on-board programmable logic without expanding PCB area.
This FPGA is appropriate for engineers and procurement teams targeting scalable, integrated designs where consolidating functions into a single programmable device can reduce BOM complexity and streamline board layouts. With RoHS compliance and standard surface-mount packaging, it fits established manufacturing flows for commercial electronics.
Request a quote or submit your requirements to receive pricing and availability information for the M1AFS1500-2FGG256.

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