M1AFS1500-2FGG256

IC FPGA 119 I/O 256FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 119 276480 256-LBGA

Quantity 217 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O119Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of M1AFS1500-2FGG256 – Fusion® FPGA, 1,500,000 gates, 256-LBGA

The M1AFS1500-2FGG256 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology. It integrates 1,500,000 gates, 38,400 logic elements and approximately 0.276 Mbits of embedded memory with 119 user I/O pins in a 256-LBGA package.

Designed for commercial-grade applications, this surface-mount FPGA operates from 1.425 V to 1.575 V and across an operating temperature range of 0 °C to 85 °C, providing a compact, programmable logic option for a variety of electronic systems.

Key Features

  • Core Logic Density 38,400 logic elements deliver significant programmable logic resources for complex combinational and sequential designs.
  • Gate Count 1,500,000 gates provide a measure of device capacity for integrating multiple functions on a single FPGA.
  • On-chip Memory Approximately 0.276 Mbits of embedded RAM for local data buffering and state storage within custom logic.
  • I/O 119 I/O pins to support a broad mix of peripheral interfaces and board-level connectivity requirements.
  • Power Operates from a core supply range of 1.425 V to 1.575 V, enabling consistent integration with targeted system power rails.
  • Package & Mounting Supplied in a 256-LBGA (256-FPBGA, 17 × 17) surface-mount package for compact PCB integration and standardized assembly.
  • Commercial Temperature Grade Rated for 0 °C to 85 °C operation to match commercial electronics deployment environments.
  • Environmental Compliance RoHS-compliant to meet standard environmental and manufacturing requirements.

Typical Applications

  • Commercial electronics — Implement custom logic and peripheral control in commercially graded electronic equipment where programmable capacity and I/O density are required.
  • Prototyping and development — Use the FPGA’s logic and embedded memory resources for hardware validation and design iteration on surface-mount evaluation boards.
  • Communications and interface bridging — Provide protocol adaptation and interface glue logic using available I/O and logic elements within the 256-LBGA footprint.

Unique Advantages

  • High logic capacity: 1,500,000 gates and 38,400 logic elements allow integration of multiple functions that would otherwise require additional devices.
  • Compact packaging: 256-LBGA (17 × 17) minimizes board area while keeping a substantial number of I/Os accessible for system design.
  • Balanced I/O complement: 119 pins provide flexibility for connecting peripherals, sensors, and external memory or logic.
  • Commercial-grade operating range: 0 °C to 85 °C rating aligns with typical commercial deployments and assembly processes.
  • RoHS-compliant: Meets common environmental manufacturing standards for streamlined production compliance.
  • Predictable power window: Defined supply range of 1.425 V to 1.575 V supports straightforward power-supply design and integration.

Why Choose M1AFS1500-2FGG256?

The M1AFS1500-2FGG256 positions itself as a commercial-grade, highly programmable solution that combines substantial logic resources, on-chip memory, and a broad I/O count in a compact 256-LBGA package. Its defined core voltage range and commercial temperature rating make it suitable for a wide range of electronic product designs that require on-board programmable logic without expanding PCB area.

This FPGA is appropriate for engineers and procurement teams targeting scalable, integrated designs where consolidating functions into a single programmable device can reduce BOM complexity and streamline board layouts. With RoHS compliance and standard surface-mount packaging, it fits established manufacturing flows for commercial electronics.

Request a quote or submit your requirements to receive pricing and availability information for the M1AFS1500-2FGG256.

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