M1AFS1500-2FG484

The M1AFS1500-2FG484 is a Fusion® field programmable gate array (FPGA) from Microchip Technology. It provides a mid-range programmable fabric with 38,400 logic elements (LEs), approximately 0.276 Mbits of embedded memory, and support for 223 user I/O signals in a compact 484-BGA package.

Designed for commercial-temperature applications, this surface-mount FPGA targets designs that require significant logic density, a large I/O count, and a tight package footprint while operating from a 1.425 V to 1.575 V supply.

Key Features

• Core Logic  Provides 38,400 logic elements and approximately 1,500,000 gates for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 276,480 bits of on-chip RAM to support buffers, FIFOs, and small data stores close to logic.
• I/O Density  223 user I/O pins enable connection to multiple peripherals, sensors, and external interfaces from a single device.
• Power  Operates from a 1.425 V to 1.575 V supply voltage for predictable core power integration.
• Package  484-BGA package (supplier device package: 484-FPBGA, 23×23) provides a compact, high-density mounting option for surface-mount PCB designs.
• Mounting and Grade  Surface-mount device rated for commercial temperature operation from 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

• Custom Logic Acceleration  Implement application-specific datapaths and control logic using 38,400 logic elements to offload tasks from a host processor.
• I/O-Intensive Interfaces  Support multi-channel sensor aggregation, protocol bridging, or peripheral interfacing with 223 available I/O pins.
• Embedded Control and Signal Processing  Use on-chip RAM and dense logic resources for control loops, finite state machines, and modest signal-processing pipelines.

Unique Advantages

• High Logic Density: 38,400 logic elements and roughly 1.5M gates enable substantial custom logic integration without external ASICs or CPLDs.
• Generous I/O Count: 223 user I/O pins reduce the need for external I/O expanders and simplify board-level routing for complex systems.
• Compact, High-Density Package: 484-BGA (23×23) footprint concentrates capability into a small PCB area for space-constrained designs.
• Predictable Power Domain: Narrow core supply range (1.425 V to 1.575 V) helps with power budgeting and regulator selection.
• Commercial Temperature Rating: 0 °C to 85 °C operating range suits a wide range of general-purpose electronics and embedded applications.
• RoHS Compliant: Meets common environmental and manufacturing process requirements for lead-free production.

Why Choose M1AFS1500-2FG484?

The M1AFS1500-2FG484 balances substantial logic capacity, on-chip memory, and a high I/O count in a compact 484-BGA package, making it well suited for commercial embedded designs that require concentrated programmable logic and flexible interfacing. Its defined core supply range and commercial temperature rating provide predictable integration into power and thermal budgets.

Choose this Fusion® FPGA when your design requires mid-range logic density, extensive I/O, and a compact surface-mount package backed by Microchip Technology manufacturing and RoHS compliance.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the M1AFS1500-2FG484.