M1AFS1500-1FGG676I

The M1AFS1500-1FGG676I is a Fusion® FPGA IC designed for industrial applications requiring mid-range programmable logic and substantial I/O. It combines 38,400 logic elements with 1,500,000 gates and on-chip embedded memory to support a wide range of custom digital functions. With an industrial operating temperature range and a compact 676-BGA package, this device is suitable for systems that demand robust environmental performance and high I/O density.

Key Features

• Core Logic 38,400 logic elements (LEs) and 1,500,000 gates to implement complex programmable logic and custom processing blocks.
• Embedded Memory Approximately 0.276 Mbits (276,480 bits) of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O Capacity 252 user I/O pins to support dense external interfacing and multiple peripheral connections.
• Power Single core voltage supply range from 1.425 V to 1.575 V to match system power rails and enable predictable power design.
• Package and Mounting 676-ball FBGA (27 × 27) package, surface-mount mounting type, providing a compact footprint for space-constrained PCBs.
• Temperature Grade Industrial temperature range from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance RoHS compliant, supporting regulatory requirements for lead-free manufacturing.

Typical Applications

• Industrial control and automation — Leverages the industrial temperature range and plentiful I/O for implementing custom control logic, sensor aggregation, and real-time interfacing.
• Communications and networking — Use the device's logic capacity and I/O density to implement protocol bridging, packet handling, or custom interface functions.
• Embedded system prototyping — Provides a flexible platform for validating custom logic, peripheral integration, and hardware acceleration with ample logic elements and RAM.

Unique Advantages

• Balanced logic and memory — 38,400 logic elements paired with on-chip RAM enable both complex combinational logic and localized data storage without immediate external memory dependency.
• High I/O count — 252 I/O pins simplify connectivity to multiple peripherals, sensors, and external interfaces, reducing the need for additional IO expanders.
• Industrial robustness — Rated for -40 °C to 100 °C operation, suitable for systems exposed to wide temperature ranges.
• Compact BGA footprint — 676-FBGA (27 × 27) packaging allows high-density board designs while maintaining manufacturability with surface-mount assembly.
• Predictable power design — Narrow core voltage range (1.425 V–1.575 V) helps simplify power-supply selection and regulation on the PCB.
• Regulatory alignment — RoHS compliance supports lead-free assembly and environmental requirements in manufacturing.

Why Choose M1AFS1500-1FGG676I?

The M1AFS1500-1FGG676I positions itself as a versatile FPGA option for industrial and embedded applications that require a mid-range balance of logic capacity, I/O density, and environmental robustness. Its combination of 38,400 logic elements, substantial gate count, and on-chip RAM supports a broad set of custom digital designs while the 252 I/O pins enable direct interfacing to multiple external components.

This device is well suited to engineers and system designers building industrial controllers, communication interfaces, or prototype platforms that benefit from a compact BGA package, RoHS compliance, and a defined operating voltage and temperature range. Choosing this FPGA helps maintain scalability and reliability within product lifecycles where predictable environmental performance and flexible I/O are priorities.

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