M1AFS1500-2FG256

The M1AFS1500-2FG256 is a Fusion® Field Programmable Gate Array (FPGA) IC designed for commercial embedded applications that require programmable logic, moderate on-chip memory, and a compact ball-grid package. With 38,400 logic elements and approximately 0.276 Mbits of embedded RAM, this device targets designs needing significant gate count and I/O density within a 256-LBGA footprint.

Key Features

• Logic Capacity  Provides 38,400 logic elements (logic cells) and 1,500,000 gates to implement medium-complexity digital designs and custom logic functions.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM to support local buffering, small lookup tables, and state storage.
• I/O Density  119 user I/O pins accommodate multiple peripheral interfaces and signal routing requirements.
• Package & Mounting  256-LBGA package (supplier package: 256-FPBGA, 17×17) in a surface-mount format for compact board layouts.
• Power  Operates from a core supply range of 1.425 V to 1.575 V to match low-voltage system domains.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial environments.
• Regulatory  RoHS compliant for use in lead-free and environmentally conscious product designs.

Typical Applications

• Commercial Embedded Systems  Implements control logic and peripheral interfacing where 38,400 logic elements and 119 I/O enable integration of multiple functions on a single device.
• Consumer Electronics  Compact 256-LBGA package and surface-mount mounting make the device suitable for space-constrained consumer boards that require programmable logic.
• Prototyping and Development  Provides a medium-capacity FPGA resource for validating designs and iterating hardware-accelerated logic before scaling.
• Interface and Glue Logic  119 I/O and substantial gate count allow consolidation of interface translation, protocol bridging, and custom timing logic.

Unique Advantages

• Substantial Logic Density:  38,400 logic elements deliver enough resources to implement complex state machines, combinational logic, and moderate parallelism without external ASICs.
• On-Chip Memory:  Approximately 0.276 Mbits of embedded RAM reduces dependence on external memory for small buffers and LUT storage, simplifying PCB design.
• High I/O Count:  119 I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Compact, Surface-Mount Package:  256-LBGA (17×17 FPBGA) enables a small board footprint while maintaining thermal and signal routing advantages for commercial products.
• Low-Voltage Operation:  Core supply range of 1.425 V to 1.575 V aligns with modern low-voltage system rails to support efficient power architectures.
• RoHS Compliant:  Meets lead-free and environmental requirements common in commercial product development.

Why Choose M1AFS1500-2FG256?

The M1AFS1500-2FG256 positions itself as a capable Fusion® FPGA for commercial designers who need a balance of logic capacity, I/O flexibility, and a compact 256-LBGA package. Its combination of 38,400 logic elements, 119 I/O pins, and embedded RAM supports integration of control, interface, and moderate processing tasks without expanding board-level BOM.

This device is suited to teams building commercial embedded products, consumer devices, and development platforms that require programmable logic with RoHS compliance and standard commercial temperature operation. The part offers a straightforward path to consolidate discrete logic and specialized interfaces into a single programmable device.

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