M1AFS1500-2FG676

The M1AFS1500-2FG676 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for programmable-logic implementations requiring high logic density and a large I/O count. It integrates a substantial complement of logic elements, embedded RAM and I/O in a compact 676-ball FBGA package to address space-constrained commercial designs.

Key Features

• Logic Capacity  Provides 38,400 logic elements (cells) and approximately 1,500,000 gates to implement complex digital functions and custom logic architectures.
• Embedded Memory  Includes approximately 0.28 Mbits (276,480 bits) of total on-chip RAM for buffers, FIFOs and small data structures required by embedded logic.
• I/O Resources  Offers 252 user I/O pins to support multiple interfaces, parallel buses and high-pin-count connectivity requirements.
• Package  Supplied in a 676-ball FBGA (27 × 27 mm) package for high-density mounting and compact board-level integration.
• Power  Operates from a core supply range of 1.425 V to 1.575 V, enabling predictable power sequencing and supply planning.
• Operating Range & Grade  Commercial-grade device specified for 0 °C to 85 °C operation and surface-mount assembly.
• Regulatory  RoHS compliant for lead-free design and manufacturing requirements.

Typical Applications

• High-Density Control Logic  Use the device to implement complex control, sequencing and custom processing functions that require large logic capacity and on-chip RAM.
• I/O-Intensive Interfaces  Ideal for designs that need numerous general-purpose I/Os or multiple parallel interfaces, leveraging the 252 available I/O pins.
• Compact Embedded Systems  Fits space-constrained assemblies that benefit from a high-pin-count FPGA in a 676-FBGA (27 × 27 mm) package.
• Commercial Electronics  Targets commercial-temperature applications where a combination of logic density and integration simplifies system design.

Unique Advantages

• High logic integration: 38,400 logic elements and 1.5 million gates enable implementation of sizable custom digital subsystems on a single device.
• On-chip memory for buffering: 276,480 bits of embedded RAM reduce external memory dependencies for small to moderate buffering needs.
• Extensive I/O capability: 252 user I/Os support multiple interfaces and parallel connections without immediate need for external I/O expanders.
• Compact, manufacturable package: 676-FBGA (27 × 27 mm) provides a small footprint for high-density PCB layouts while supporting surface-mount assembly.
• Commercial-temperature suitability: Specified for 0 °C to 85 °C operation to meet common commercial electronics deployment requirements.
• RoHS compliant: Facilitates adherence to lead-free manufacturing and environmental directives.

Why Choose M1AFS1500-2FG676?

The M1AFS1500-2FG676 positions itself as a high-density Fusion® FPGA option for commercial designs that require a balance of logic resources, embedded memory and a large I/O complement in a compact BGA package. Its combination of 38,400 logic elements, substantial gate count and 252 I/Os makes it suitable for engineered solutions where board space and integration are important considerations.

Backed by Microchip Technology, this device is intended for designers seeking a programmable, RoHS-compliant FPGA with defined commercial-temperature operation and a clear set of electrical, memory and packaging specifications to plan around.

Request a quote or submit an inquiry today to obtain pricing and availability for the M1AFS1500-2FG676.