M1AFS1500-1FGG484

The M1AFS1500-1FGG484 is a Fusion® field programmable gate array supplied in a 484-ball fine-pitch BGA (23×23) package. It is a commercial-grade FPGA designed to deliver configurable logic, embedded memory, and a high I/O count for compact, surface-mount system designs.

With 38,400 logic elements, approximately 0.28 Mbits of embedded memory, 223 user I/Os and about 1,500,000 gates, this device is suited for commercial embedded applications where a balance of integration, I/O density and package compactness is required. It operates from a core supply of 1.425 V to 1.575 V and supports commercial temperature ranges (0 °C to 85 °C).

Key Features

• Core Logic  Provides 38,400 logic elements (LEs) and approximately 1,500,000 gates for mid-range programmable logic functions and system integration.
• Embedded Memory  Contains approximately 276,480 bits of on-chip RAM, suitable for buffering, small LUT-based storage and intermediate data handling.
• I/O Density  223 general-purpose I/O pins support a wide range of external interfaces and parallel/serial connectivity needs within a single device.
• Power and Voltage  Core supply nominal range of 1.425 V to 1.575 V for predictable power planning and board-level integration.
• Package and Mounting  484-FPBGA (23×23) surface-mount package provides a compact footprint for space-constrained commercial designs.
• Operating Temperature and Grade  Commercial grade device specified for 0 °C to 85 °C operation.
• Compliance  RoHS-compliant construction supports regulatory requirements for lead-free assemblies.

Typical Applications

• Commercial Embedded Systems  Used to implement custom logic, glue-logic and protocol handling in compact commercial devices.
• Communications and Networking Modules  Provides programmable I/O and logic resources for packet processing, interface bridging and timing control in communications equipment.
• Prototyping and System Integration  Offers a reconfigurable platform for hardware validation, proof-of-concept designs and integration of custom peripherals.
• Custom I/O and Protocol Bridging  High I/O count supports implementations that require multiple parallel interfaces or mixed-signal front-end interfacing on commercial products.

Unique Advantages

• High Logic Density: 38,400 logic elements enable substantial on-chip implementation of custom functions without external ASICs or CPLDs.
• Balanced Embedded Memory: Approximately 0.28 Mbits of RAM supports buffering and small data storage requirements directly on-chip.
• Extensive I/O Count: 223 I/Os reduce the need for external I/O expanders and simplify board-level routing for multi-interface designs.
• Compact BGA Footprint: 484-FPBGA (23×23) package delivers high integration in a surface-mount form factor suitable for dense PCBs.
• Commercial Temperature and RoHS Compliance: Specified for 0 °C to 85 °C operation and built to meet RoHS requirements for lead-free assemblies.

Why Choose M1AFS1500-1FGG484?

The M1AFS1500-1FGG484 positions itself as a versatile, commercial-grade Fusion® FPGA that combines substantial logic capacity, embedded memory and a large number of I/Os in a compact 484-BGA package. It is well suited for designers who need mid-range programmable logic for commercial embedded products, communications modules and system integration tasks where board space and I/O density matter.

Its defined voltage range, commercial temperature rating and RoHS compliance provide predictable integration parameters for production designs. For projects requiring scalable programmable logic with on-chip memory and extensive connectivity, the M1AFS1500-1FGG484 offers a clear, specification-driven option.

Request a quote or contact sales to discuss availability, pricing and how the M1AFS1500-1FGG484 can meet your design requirements.