M1AFS1500-1FGG256K

The M1AFS1500-1FGG256K is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a hardware-configurable logic platform with 38,400 logic elements and approximately 0.276 Mbits of embedded memory for on-chip data storage.

Designed as a surface-mount, military-grade device, this FPGA offers 119 I/O pins, roughly 1.5 million gates of logic capacity, and a 256‑LBGA package for compact board-level integration. Its specified supply range and extended operating temperature make it suitable for designs requiring robust thermal and electrical margins.

Key Features

• Core Logic 38,400 logic elements (cells) supporting up to 1,500,000 gates for implementing custom digital logic and state machines.
• Embedded Memory Approximately 0.276 Mbits (276,480 bits) of on-chip RAM for data buffering, FIFOs, and small lookup tables.
• I/O Capacity 119 general-purpose I/O pins to support multiple external interfaces and parallel connections.
• Power Specified voltage supply range of 1.425 V to 1.575 V to match compatible core power rails.
• Package & Mounting 256‑LBGA package (supplier device package: 256‑FPBGA, 17×17) in a surface-mount form factor for compact PCB layouts and reliable solder attachment.
• Temperature & Grade Military-grade device with an operating temperature range of −55 °C to 100 °C for high-reliability and wide-temperature applications.
• Environmental Compliance RoHS compliant, meeting common restrictions on hazardous substances for electronic assemblies.

Typical Applications

• Military and Aerospace Electronics — Military-grade temperature range and rugged specification support deployment in avionics, tactical systems, and other defense electronics requiring extended temperature performance.
• Embedded Control Systems — Use the FPGA’s logic elements and on-chip RAM to implement custom control logic, interface bridging, and deterministic signal processing.
• I/O-Intensive Designs — With 119 I/O pins, the device suits applications that require multiple parallel or multiplexed external connections.

Unique Advantages

• Substantial Logic Density: 38,400 logic elements and ~1.5 million gates enable complex digital functions to be consolidated onto a single device, reducing component count.
• Embedded Memory On-Board: Approximately 0.276 Mbits of RAM supports local buffering and small working datasets without external memory.
• Wide Operating Temperature: Rated from −55 °C to 100 °C to maintain functionality across extreme environments common to military applications.
• Compact, Surface-Mount Package: 256‑LBGA (17×17 FPBGA footprint) offers a space-efficient solution for dense PCB designs.
• Controlled Core Supply Range: Tight supply window (1.425–1.575 V) simplifies power sequencing and ensures predictable core operation when matched to proper power rails.
• RoHS Compliant: Meets environmental restrictions for hazardous substances, facilitating compliance in regulated assemblies.

Why Choose M1AFS1500-1FGG256K?

The M1AFS1500-1FGG256K positions itself as a compact, military-grade FPGA option within the Fusion® family, combining substantial logic capacity, embedded memory, and a high I/O count in a 256‑LBGA package. Its specified supply range and extended temperature rating make it appropriate for designs that demand reliable operation across challenging environments.

This device is suited to engineers and procurement teams looking for a Microchip Technology FPGA that balances on-chip resources and rugged specifications for long-term, field-deployed digital systems.

Request a quote or submit an inquiry to obtain pricing and availability for the M1AFS1500-1FGG256K and to discuss volume needs or lead times with our sales team.