M1AFS1500-1FG676

The M1AFS1500-1FG676 is a Fusion® field programmable gate array (FPGA) designed for board-level integration where programmable digital logic, on-chip memory and flexible I/O are required. It provides a balance of logic capacity, embedded memory and a high pin-count package for dense system designs.

With 38,400 logic elements, approximately 0.276 Mbits of embedded memory and 252 I/O, this device targets applications that need significant programmable resources and a compact 676-ball BGA footprint.

Key Features

• Core Logic 38,400 logic elements (LEs) supporting up to 1,500,000 gates to implement complex custom logic and glue functions.
• Embedded Memory Approximately 0.276 Mbits of on-chip RAM for data buffering, state machines and local storage.
• I/O Capacity 252 general-purpose I/O pins to support multiple interfaces and parallel connectivity at the board level.
• Package & Mounting 676-ball BGA (27 × 27) supplier package in a surface-mount form factor for compact, high-density PCB layouts.
• Power Supply Core voltage supply range of 1.425 V to 1.575 V for integration with defined power rails.
• Operating Range & Grade Commercial grade operation from 0 °C to 85 °C suitable for standard temperature environments.
• Regulatory RoHS compliant.

Typical Applications

• Custom digital logic — Implement glue logic, protocol translation and custom processing pipelines using the device's 38,400 logic elements.
• I/O-intensive interfaces — Use the 252 I/O pins to consolidate multiple board-level interfaces and parallel connections.
• Embedded buffering and control — Leverage approximately 0.276 Mbits of on-chip RAM for buffering, FIFOs or small data stores close to logic.
• Compact system integration — The 676-BGA surface-mount package enables high-density PCB layouts where board space is constrained.

Unique Advantages

• High logic density: 38,400 logic elements and 1,500,000 gates provide headroom for complex designs and integration of multiple functions on a single device.
• Significant on-chip memory: Approximately 0.276 Mbits of embedded RAM reduces reliance on external memory for small buffers and state storage.
• Extensive I/O count: 252 I/O pins support diverse interface requirements and simplify board-level interconnects.
• Compact, high-pin-count packaging: 676-BGA (27 × 27) enables dense routing and a small PCB footprint for space-constrained applications.
• Defined power domain: Narrow core supply range (1.425 V–1.575 V) helps predictable integration with regulated power rails.
• RoHS compliant: Environmentally compliant manufacturing and assembly alignment.

Why Choose M1AFS1500-1FG676?

The M1AFS1500-1FG676 positions itself as a balanced Fusion® FPGA option for designs that require substantial programmable logic, embedded memory and a large number of I/O in a compact surface-mount BGA package. Its combination of 38,400 logic elements, approximately 0.276 Mbits of on-chip RAM and 252 I/O pins makes it suitable for consolidating functions and reducing board-level complexity.

This device is well suited to customers building commercial-grade systems where board space, I/O count and integrated memory are key design drivers. The defined voltage range, commercial operating temperature and RoHS compliance simplify system-level planning and regulatory alignment.

Request a quote or submit an inquiry to obtain pricing and availability for the M1AFS1500-1FG676. Our team can provide lead-time and ordering information to support your design schedule.