M1AFS1500-1FG256K

IC FPGA 119 I/O 256FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 119 276480 256-LBGA

Quantity 596 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeMilitaryOperating Temperature-55°C – 100°C
Package / Case256-LBGANumber of I/O119Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of M1AFS1500-1FG256K – Fusion® Field Programmable Gate Array (FPGA) IC, 119 I/Os, 276480-bit RAM, 256‑LBGA

The M1AFS1500-1FG256K is a Fusion® field-programmable gate array (FPGA) from Microchip Technology, offered in a 256‑LBGA package. It provides a balance of programmable logic capacity, embedded memory, and I/O count suited for military-grade and rugged embedded applications that require wide operating temperature and controlled supply rails.

Key Features

  • Core Logic 38,400 logic elements (cells) delivering 1,500,000 gates of programmable logic for implementing custom digital functions.
  • Embedded Memory Approximately 0.28 Mbits of on-chip RAM (276,480 total RAM bits) to support buffering, state machines, and small data storage needs.
  • I/O Count 119 I/O pins to interface with external peripherals, sensors, and system buses.
  • Power Specified supply voltage range of 1.425 V to 1.575 V for core operation, enabling precise power budgeting in multi-rail systems.
  • Package & Mounting 256‑LBGA package (supplier device package: 256‑FPBGA, 17×17) with surface-mount mounting suitable for compact board layouts.
  • Environmental & Grade Military grade with an operating temperature range of −55 °C to 100 °C; RoHS compliant for environmental conformance.

Typical Applications

  • Military and Aerospace Systems — Designed for applications that require military-grade components and an extended operating temperature range.
  • Rugged Embedded Control — Suitable for industrial and fielded control systems where robust temperature performance and compact packaging are needed.
  • Communications Equipment — Use for protocol handling, custom packet processing, and interface bridging with its programmable logic and moderate I/O count.
  • High-Reliability Instrumentation — Applicable in measurement and telemetry systems that demand defined supply rails and deterministic hardware logic.

Unique Advantages

  • Military-Grade Qualification: Rated for −55 °C to 100 °C and explicitly graded Military, supporting deployment in harsh and mission-critical environments.
  • Balanced Logic and Memory: 38,400 logic elements with approximately 0.28 Mbits of embedded RAM enables implementation of substantial custom logic and local buffering without external memory for many use cases.
  • Ample I/O Count: 119 I/Os provide flexible interfacing options for sensors, peripherals, and communications links while keeping board routing manageable.
  • Defined Core Supply Range: Tight supply specification (1.425 V to 1.575 V) simplifies power-supply design and helps ensure predictable timing and operation.
  • Compact, Surface-Mount Packaging: 256‑LBGA (256‑FPBGA, 17×17) enables high-density integration in space-constrained designs.
  • RoHS Compliant: Environmentally compliant manufacturing for use in assemblies that require lead-free components.

Why Choose M1AFS1500-1FG256K?

The M1AFS1500-1FG256K positions itself as a military-grade Fusion® FPGA option offering a practical mix of logic capacity, on-chip RAM, and I/O density in a compact 256‑LBGA package. Its defined core voltage range and extended temperature rating make it a suitable choice for engineers designing rugged embedded systems, defense electronics, and communications equipment that require predictable electrical and thermal behavior.

Backed by Microchip Technology, this device fits designs that need scalable programmable logic without excessive board-level complexity, delivering long-term robustness and manufacturability for fielded systems.

If you would like pricing information, lead-time details, or to request a quote for the M1AFS1500-1FG256K, please contact sales or submit a quote request through your preferred procurement channel.

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