M1AFS1500-1FG256

The M1AFS1500-1FG256 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for reconfigurable digital logic implementations. It provides a balance of logic capacity, on-chip memory and a broad I/O complement in a compact 256-LBGA package.

With 38,400 logic elements and approximately 0.276 Mbits of embedded memory, this commercial-grade FPGA addresses applications that require moderate programmable logic, flexible I/O and a compact surface-mount footprint.

Key Features

• Logic Capacity  38,400 logic elements (LEs) supporting up to 1,500,000 gates for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM for buffering, small data storage and state machines.
• I/O Resources  119 user I/O pins providing flexible interfacing to peripherals, sensors and external devices.
• Power  Specified supply range of 1.425 V to 1.575 V to meet system voltage requirements within that window.
• Package and Mounting  256-LBGA package (supplier package: 256-FPBGA, 17×17) with surface-mount mounting for compact board designs.
• Operating Range  Commercial temperature grade with an operating range of 0°C to 85°C for standard commercial environments.
• Compliance  RoHS compliant for regulatory environmental requirements.

Typical Applications

• Embedded Control  Implement custom control logic and peripheral glue logic where moderate logic density and on-chip RAM are required.
• I/O Expansion and Interface Bridging  Use the 119 I/Os to aggregate, translate or buffer signals between multiple subsystems.
• Prototyping and Development  Suitable for hardware prototypes that need reconfigurable logic in a compact surface-mount package.
• Compact System Integration  Integrate programmable logic into space-constrained PCBs using the 256-LBGA footprint.

Unique Advantages

• Substantial Logic Density: 38,400 logic elements enable implementation of complex finite-state machines and mid-range logic blocks without external ASICs.
• On-chip Memory: Approximately 0.276 Mbits of embedded RAM reduces the need for small external memory devices for buffering and temporary storage.
• Generous I/O Count: 119 I/Os allow direct interfacing to multiple peripherals, sensors and external buses, simplifying board-level routing.
• Compact Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) supports high-density board layouts while maintaining a reliable solderable mounting.
• Commercial Temperature Rating: Rated 0°C to 85°C for applications operating in standard commercial environments.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product designs.

Why Choose M1AFS1500-1FG256?

The M1AFS1500-1FG256 positions itself as a compact, mid-density FPGA option delivering 38,400 logic elements, approximately 0.276 Mbits of embedded memory and 119 I/Os in a 256-LBGA package. Its defined supply range and commercial temperature rating make it suitable for a wide range of standard embedded and board-level applications that need reconfigurable logic without large package footprints.

Designed and manufactured by Microchip Technology, this device provides a practical balance of integration and board-level flexibility for engineers seeking to reduce BOM complexity and accelerate development cycles while retaining the ability to reprogram and iterate hardware functionality.

Request a quote or submit a product inquiry to discuss pricing, availability and how the M1AFS1500-1FG256 can fit into your next design.