M1AFS1500-1FG676I

IC FPGA 252 I/O 676FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 252 276480 676-BGA

Quantity 1,869 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O252Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of M1AFS1500-1FG676I – Fusion® Field Programmable Gate Array IC, 252 I/O, 676-BGA

The M1AFS1500-1FG676I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology offered in a 676-BGA surface-mount package. It is specified as an industrial-grade device and is suited for designs that require on-chip reconfigurable logic with substantial I/O and memory resources.

As listed, the device provides 38,400 logic elements, approximately 0.276 Mbits of embedded memory, 252 I/O pins and 1,500,000 gates, operates from 1.425 V to 1.575 V, and supports an operating temperature range of −40 °C to 100 °C.

Key Features

  • Core / Logic Capacity — 38,400 logic elements (CLBs) and 1,500,000 gates as specified for on-chip programmable logic.
  • Embedded Memory — Approximately 0.276 Mbits of on-chip RAM to support state storage and intermediate buffering.
  • I/O Density — 252 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
  • Package — 676-BGA (supplier package: 676-FBGA, 27 × 27 mm) in a surface-mount form factor for compact system integration.
  • Power — Specified core supply range of 1.425 V to 1.575 V to match system power rails.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for robust performance in industrial environments.
  • Compliance — RoHS compliant.

Unique Advantages

  • Substantial Logic Resources: 38,400 logic elements and 1,500,000 gates provide a significant resource pool for implementing complex logic functions on-chip.
  • Compact High‑I/O Package: 252 I/O in a 676-BGA enable high pin-count connectivity in a space-efficient, surface-mount footprint.
  • On‑Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces external memory needs for many control and buffering tasks.
  • Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
  • Controlled Core Voltage: Narrow core supply range (1.425 V–1.575 V) helps streamline power-supply design and margining.
  • Regulatory Compliance: RoHS compliance supports regulatory and sustainability requirements.

Why Choose M1AFS1500-1FG676I?

The M1AFS1500-1FG676I positions itself as an industrial-grade, mid-to-high-density FPGA option from Microchip Technology, combining a large logic element count, modest on-chip memory, and a high I/O count in a compact 676-BGA package. These characteristics make it suitable for system designs that require on-board reprogrammable logic with robust environmental capability.

For engineers and procurement teams, this device offers a balance of integration, I/O capacity, and temperature robustness backed by Microchip Technology documentation for the Fusion series, enabling scalable deployment in industrial applications where reconfigurable logic and reliable operation are required.

Request a quote or submit a request for pricing and availability to receive detailed lead-time and procurement information for the M1AFS1500-1FG676I.

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