M1AFS1500-1FG676I
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 252 276480 676-BGA |
|---|---|
| Quantity | 1,869 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 252 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1AFS1500-1FG676I – Fusion® Field Programmable Gate Array IC, 252 I/O, 676-BGA
The M1AFS1500-1FG676I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology offered in a 676-BGA surface-mount package. It is specified as an industrial-grade device and is suited for designs that require on-chip reconfigurable logic with substantial I/O and memory resources.
As listed, the device provides 38,400 logic elements, approximately 0.276 Mbits of embedded memory, 252 I/O pins and 1,500,000 gates, operates from 1.425 V to 1.575 V, and supports an operating temperature range of −40 °C to 100 °C.
Key Features
- Core / Logic Capacity — 38,400 logic elements (CLBs) and 1,500,000 gates as specified for on-chip programmable logic.
- Embedded Memory — Approximately 0.276 Mbits of on-chip RAM to support state storage and intermediate buffering.
- I/O Density — 252 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
- Package — 676-BGA (supplier package: 676-FBGA, 27 × 27 mm) in a surface-mount form factor for compact system integration.
- Power — Specified core supply range of 1.425 V to 1.575 V to match system power rails.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for robust performance in industrial environments.
- Compliance — RoHS compliant.
Unique Advantages
- Substantial Logic Resources: 38,400 logic elements and 1,500,000 gates provide a significant resource pool for implementing complex logic functions on-chip.
- Compact High‑I/O Package: 252 I/O in a 676-BGA enable high pin-count connectivity in a space-efficient, surface-mount footprint.
- On‑Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces external memory needs for many control and buffering tasks.
- Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
- Controlled Core Voltage: Narrow core supply range (1.425 V–1.575 V) helps streamline power-supply design and margining.
- Regulatory Compliance: RoHS compliance supports regulatory and sustainability requirements.
Why Choose M1AFS1500-1FG676I?
The M1AFS1500-1FG676I positions itself as an industrial-grade, mid-to-high-density FPGA option from Microchip Technology, combining a large logic element count, modest on-chip memory, and a high I/O count in a compact 676-BGA package. These characteristics make it suitable for system designs that require on-board reprogrammable logic with robust environmental capability.
For engineers and procurement teams, this device offers a balance of integration, I/O capacity, and temperature robustness backed by Microchip Technology documentation for the Fusion series, enabling scalable deployment in industrial applications where reconfigurable logic and reliable operation are required.
Request a quote or submit a request for pricing and availability to receive detailed lead-time and procurement information for the M1AFS1500-1FG676I.

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