M1AFS1500-FG256I

The M1AFS1500-FG256I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It provides 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and 119 user I/Os in a compact 256-LBGA package.

This device targets embedded and industrial control designs that require flexible, reconfigurable logic, a high I/O count, and operation across a wide industrial temperature range. Its specified core supply range and surface-mount package support modern board-level integration and automated assembly.

Key Features

• Core Logic 38,400 logic elements (cells) and approximately 1,500,000 gates provide the programmable fabric for custom logic implementations.
• Embedded Memory Approximately 0.276 Mbits of on-chip RAM for buffering, state storage, and small data structures.
• I/O Capability 119 user I/Os to support a broad set of peripheral connections and parallel interfaces on dense boards.
• Power Supply Specified core voltage range of 1.425 V to 1.575 V for the device power rail.
• Package and Mounting 256-LBGA (supplier package: 256-FPBGA, 17 × 17 mm) in a surface-mount form factor suitable for automated PCB assembly.
• Operating Range and Grade Industrial-grade device rated for operation from –40 °C to 100 °C.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control Use the FPGA’s 38,400 logic elements and 119 I/Os to implement custom control logic, I/O aggregation, and protocol bridging in industrial systems.
• Embedded Processing On-chip memory and programmable logic enable implementation of application-specific datapaths and control state machines for embedded devices.
• Interface and Glue Logic The device’s I/O count and configurable fabric make it suitable for consolidating interface logic between multiple peripherals and subsystems.

Unique Advantages

• Highly configurable logic capacity: 38,400 logic elements allow designers to implement complex custom logic without external ASICs.
• Integrated on-chip memory: Approximately 0.276 Mbits of embedded RAM reduces external memory needs for small buffers and state storage.
• Substantial I/O density: 119 user I/Os provide flexibility for parallel interfaces, multiple sensors, and peripheral connections.
• Industrial temperature capability: Rated for –40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact surface-mount package: 256-LBGA (256-FPBGA, 17×17) supports high-density PCB designs and automated assembly processes.
• Controlled core voltage: Defined supply range (1.425 V–1.575 V) for predictable power integration.

Why Choose M1AFS1500-FG256I?

The M1AFS1500-FG256I positions itself as an industrial-grade, reconfigurable logic solution offering a balanced combination of logic capacity, embedded memory, and a high I/O count in a compact 256-LBGA package. Its specified operating temperature range and RoHS compliance make it suitable for long-lived industrial and embedded designs that require reliable, board-level integration.

Designers and procurement teams seeking an FPGA with measurable logic resources, clear supply-voltage requirements, and industrial temperature capability will find the M1AFS1500-FG256I appropriate for control, interface, and embedded-processing tasks where on-board reconfigurability is required.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for the M1AFS1500-FG256I.