M1AFS1500-FG484I
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 223 276480 484-BGA |
|---|---|
| Quantity | 490 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 223 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1AFS1500-FG484I – Fusion® Field Programmable Gate Array (FPGA) IC, 223 I/O, 484-BGA
The M1AFS1500-FG484I is a Fusion® field programmable gate array (FPGA) offered in a 484-ball fine-pitch BGA package. It provides a programmable logic fabric with 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and 223 user I/Os for configurable digital designs.
Designed for industrial applications, this device combines significant on-chip logic and memory resources with a compact 484-FPBGA (23×23) package and an industrial temperature rating for deployment in temperature-challenging environments.
Key Features
- Logic Capacity 38,400 logic elements (LAB/CLB equivalent) delivering a total of 1,500,000 gates for implementing custom digital functions and state machines.
- Embedded Memory Approximately 0.276 Mbits of on-chip RAM to support buffers, FIFOs, and local storage for datapath and control logic.
- I/O Resources 223 user I/O pins to interface with external peripherals, sensors, or other system components.
- Power and I/O Supply Core voltage supply range from 1.425 V to 1.575 V to match platform power requirements.
- Package and Mounting 484-FPBGA (23×23) package in a surface-mount form factor for compact board integration.
- Industrial Temperature Range Qualified for operation from −40 °C to 100 °C, suitable for industrial environments.
- Compliance RoHS compliant to support lead-free manufacturing processes.
Typical Applications
- Industrial Automation Implement custom control logic and I/O aggregation using the device's 38,400 logic elements and 223 I/Os within industrial temperature ranges.
- Embedded Systems Use the on-chip memory and programmable fabric to create tailored datapath and interface functions in compact, surface-mount designs.
- Prototyping and Integration Leverage the FPGA's gate count and I/O density in developing and validating system-level digital functions prior to production.
Unique Advantages
- Significant Logic Density: 38,400 logic elements and 1,500,000 gates enable complex custom logic implementations without external processors for many control and signal tasks.
- On-Chip Memory for Local Storage: Approximately 0.276 Mbits of embedded RAM reduces the need for external memory in buffering and state retention use cases.
- High I/O Count: 223 user I/Os provide flexible connectivity options for interfacing multiple peripherals or buses directly to the FPGA fabric.
- Industrial-Grade Operation: Rated for −40 °C to 100 °C operation, supporting deployment in temperature-challenging industrial environments.
- Compact Surface-Mount Package: 484-FPBGA (23×23) delivers a balance of pin count and board space efficiency for dense designs.
- RoHS Compliant: Suitable for lead-free assembly and modern manufacturing processes.
Why Choose M1AFS1500-FG484I?
The M1AFS1500-FG484I positions itself as a versatile industrial FPGA that combines substantial logic capacity, embedded memory, and a high I/O count in a compact 484-ball FPBGA package. Its operating voltage range and industrial temperature rating make it suitable for designs that require reliable programmable logic in constrained board space.
This device is a practical choice for engineers building industrial and embedded systems that need on-chip logic scaling, moderate embedded memory, and extensive I/O without sacrificing package density or board-level integration.
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