M1AFS1500-FGG256

The M1AFS1500-FGG256 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, offered in a 256-LBGA package. It delivers 38,400 logic elements and approximately 0.276 Mbits of embedded memory, together with 119 programmable I/O and about 1,500,000 gates for mid-range FPGA designs.

Packaged as a surface-mount 256-FPBGA (17×17) device and rated for commercial operation from 0 °C to 85 °C, the part operates with a core supply range of 1.425 V to 1.575 V and is RoHS compliant.

Key Features

• Logic Capacity — 38,400 logic elements provide substantial programmable logic resources and approximately 1,500,000 gates for implementing complex combinational and sequential logic.
• Embedded Memory — Approximately 0.276 Mbits of on-chip RAM for buffering, small FIFOs, and distributed storage close to logic functions.
• I/O Density — 119 I/O pins to support multiple peripheral interfaces and board-level interconnect requirements.
• Power — Core voltage supply range of 1.425 V to 1.575 V to match system power rails and power budgeting requirements.
• Package & Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB layouts and automated assembly.
• Temperature & Grade — Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant for global environmental requirements.

Typical Applications

• Mid-range programmable logic implementations — Use the available 38,400 logic elements and 1,500,000 gates to implement custom control, data-path, and glue-logic functions within commercial embedded systems.
• I/O-heavy interface bridging — With 119 I/O pins, the device suits board-level interface tasks that require multiple peripheral connections or protocol translation.
• On-chip buffering and small-data storage — Approximately 0.276 Mbits of embedded RAM supports local buffering, small FIFOs, and temporary storage close to processing logic.

Unique Advantages

• Balanced logic and memory — The combination of 38,400 logic elements and embedded RAM offers a practical balance for many mid-range programmable designs without overspecifying resources.
• High gate count for complex designs — Approximately 1,500,000 gates enable integration of multiple functions and moderate complexity in a single device.
• Ample I/O in a compact package — 119 I/O in a 256-LBGA (256-FPBGA, 17×17) package supports dense interconnections while maintaining a small PCB footprint.
• Commercial temperature suitability — Rated for 0 °C to 85 °C to meet standard commercial application temperature requirements.
• RoHS compliant — Meets environmental directives for lead-free manufacturing and global deployment.

Why Choose M1AFS1500-FGG256?

The M1AFS1500-FGG256 positions itself as a mid-range Fusion® FPGA solution from Microchip Technology that combines sizeable logic resources, embedded memory, and extensive I/O in a compact 256-LBGA surface-mount package. Its electrical and thermal specifications make it well suited for commercial embedded designs that require on-chip programmability, moderate memory, and flexible interfacing.

Engineers and designers seeking a commercial-grade FPGA with a balanced mix of logic elements, gates, and I/O count will find this part appropriate for consolidating functions, reducing external components, and streamlining PCB layouts while remaining within standard commercial temperature and supply ranges.

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