M1AFS1500-FGG256I

The M1AFS1500-FGG256I is a Fusion® field programmable gate array (FPGA) IC designed for industrial applications. It integrates a substantial logic fabric and embedded memory in a compact 256-LBGA package to support mid-density programmable designs.

With 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and 119 general-purpose I/O, this device targets systems that require flexible digital integration, moderate on-chip memory, and reliable operation across an industrial temperature range.

Key Features

• Core Logic 38,400 logic elements supporting up to 1,500,000 gates to implement custom digital functions and state machines.
• Embedded Memory Approximately 0.276 Mbits (276,480 bits) of on-chip RAM for buffering, lookup tables, and small data storage.
• I/O Count 119 available I/O pins to interface with sensors, peripherals, and external devices in mixed-signal system designs.
• Power Single core voltage supply range of 1.425 V to 1.575 V for stable device operation within specified limits.
• Package and Mounting 256-LBGA (supplier package: 256-FPBGA, 17 × 17 mm) in a surface-mount form factor for compact board implementations.
• Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Compliance RoHS-compliant construction for conformity with common environmental regulations.

Typical Applications

• Industrial Control & Automation — Use the FPGA’s logic capacity and I/O density for motor control, PLC interfaces, and custom control logic within industrial systems.
• Sensor Aggregation and Preprocessing — Implement signal aggregation, conditioning logic, and preprocessing before handing data to a host processor.
• Human-Machine Interfaces (HMI) — Drive custom UI logic and peripheral interfaces where moderate logic resources and multiple I/Os are required.

Unique Advantages

• Substantial Logic Density: 38,400 logic elements allow implementation of complex combinatorial and sequential logic without external glue logic.
• On-Chip Memory for Local Data Tasks: Approximately 0.276 Mbits of embedded RAM supports buffering and small LUT-based functions, reducing external memory needs.
• Flexible I/O Count: 119 I/O pins enable direct interfacing to a wide range of sensors, actuators, and peripherals.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to suit equipment deployed in harsh or variable environments.
• Compact, Surface-Mount Package: 256-LBGA (17 × 17 mm) balances board-space efficiency with a robust soldered connection for production assembly.
• Regulatory Compliance: RoHS conformity simplifies adoption in products that require environmental compliance.

Why Choose M1AFS1500-FGG256I?

The M1AFS1500-FGG256I provides a balanced combination of logic capacity, embedded memory, and I/O resources in an industrial-grade FPGA package. Its specified voltage and temperature ranges make it appropriate for designs that demand reliable, long-term operation in challenging environments.

This device is well suited for engineers building mid-density programmable solutions—especially where compact packaging, multiple I/O, and on-chip RAM reduce system complexity and BOM count. Its RoHS compliance and surface-mount 256-LBGA footprint support streamlined manufacturing and regulatory requirements.

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