M1AFS1500-FGG484K

The M1AFS1500-FGG484K is a Fusion® field-programmable gate array (FPGA) offered in a 484-FPGA package. The device provides 38,400 logic elements and approximately 0.276 Mbits of embedded memory, delivered in a 484-FPGA (23×23) surface-mount package.

Designed and specified for military-grade environments, the device supports an operating temperature range of -55 °C to 100 °C and a core supply voltage range of 1.425 V to 1.575 V, making it suitable for applications that require rugged, reliable programmable logic with high I/O density.

Key Features

• Logic Capacity  Provides 38,400 logic elements (LEs) and approximately 1,500,000 gates to implement complex digital logic and custom processing functions.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for local data storage and buffering within programmable logic designs.
• I/O Density  223 user I/O pins enable interfacing to multiple peripherals, sensors, and high-pin-count subsystems.
• Package & Mounting  Supplied in a 484-FPBBGA (484-FPBGA, 23×23) surface-mount package for compact board-level integration.
• Power  Core supply voltage specified between 1.425 V and 1.575 V to match low-voltage system designs.
• Environmental & Grade  Military-grade device with an extended operating temperature range of -55 °C to 100 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Military and Rugged Systems  Programmable logic for defense and ruggedized electronics where wide temperature range and military-grade components are required.
• High-Density I/O Interfaces  Board-level designs that require large numbers of general-purpose I/Os to connect to sensors, transceivers, and external controllers.
• Compact Embedded Systems  Space-constrained applications that benefit from a 484-FPBGA package and on-chip memory for localized buffering and control logic.
• Low-Voltage Core Designs  Systems that use a narrow core supply voltage window can integrate this FPGA with a 1.425 V–1.575 V supply requirement.

Unique Advantages

• High Logic Density: 38,400 logic elements enable implementation of complex custom logic without immediate need for external ASICs or CPLDs.
• Significant On-Chip RAM: Approximately 0.276 Mbits of embedded memory reduces dependence on external memory for small buffering and state storage.
• Large I/O Count: 223 I/O pins simplify system integration by providing direct interfaces to multiple peripherals and subsystems.
• Rugged Thermal Range: Specified from -55 °C to 100 °C to support deployments in harsh and temperature-extreme environments.
• Military Grade: Grade designation supports procurement and design choices where military-grade components are required.
• Compact Surface-Mount Package: 484-FPBGA (23×23) packaging enables dense PCB implementations while retaining extensive I/O and logic resources.

Why Choose M1AFS1500-FGG484K?

The M1AFS1500-FGG484K combines substantial logic capacity, embedded memory, and a high I/O count in a military-grade, surface-mount 484-FPBGA package. Its defined supply voltage range and extended operating temperature make it a practical choice for designs that require dependable programmable logic in challenging environments.

This Fusion® family FPGA is suited to engineering teams and procurement organizations seeking a rugged, high-density programmable device that balances integration, environmental robustness, and compact packaging for long-term deployment.

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