M1AFS250-1FG256I

The M1AFS250-1FG256I is a Fusion® FPGA IC designed for industrial applications that require mid-density programmable logic and on-chip memory. Built around 6,144 logic elements and 36,864 bits of embedded RAM, this device provides a compact, surface-mount FPGA solution with 114 user I/O and a 256-ball LBGA package.

With a low-voltage core supply range and an extended operating temperature range, the M1AFS250-1FG256I is suited for embedded control, signal processing and I/O-rich applications where a balance of logic capacity, memory and industrial-grade reliability is needed.

Key Features

• Core Logic — 6,144 logic elements (LEs) delivering programmable combinational and sequential resources for custom logic and control functions.
• Embedded Memory — 36,864 bits of on-chip RAM (approximately 0.037 Mbits) for data buffering, small FIFOs and state storage close to the logic.
• I/O Density — 114 user I/O pins to support multiple peripheral interfaces, sensor connections and control signals.
• Package and Mounting — 256-LBGA (supplier package: 256-FPBGA 17×17) optimized for surface-mount assembly in space-constrained PCBs.
• Power — Core supply range from 1.425 V to 1.575 V to match low-voltage system designs.
• Industrial Temperature Range — Rated for operation from −40°C to 100°C for industrial environments.
• Device Capacity — Approximately 250,000 gates for implementing moderate-complexity digital designs.
• Mounting Type — Surface mount for automated PCB assembly and reliable mechanical integration.

Typical Applications

• Industrial Control — Implement motor control logic, sensor interfacing and deterministic I/O handling within industrial temperature ranges.
• Embedded Systems — Integrate custom processing, glue logic and interface bridging where compact packaging and moderate logic count are required.
• Communications & Networking — Provide protocol handling, packet buffering and I/O aggregation using on-chip RAM and available logic resources.
• Signal Processing — Support data path elements, small buffers and control state machines suitable for mid-density signal-processing tasks.

Unique Advantages

• Balanced Logic and Memory: 6,144 logic elements paired with 36,864 bits of embedded RAM provide a practical mix for control, buffering and moderate data-path implementations.
• High I/O Count: 114 user I/O pins enable direct connection to a broad set of peripherals and sensors, reducing the need for external I/O expanders.
• Industrial-Grade Operation: Specified for −40°C to 100°C operation to meet the environmental demands of industrial deployments.
• Compact LBGA Footprint: 256-LBGA (17×17 FPBGA) allows dense PCB layouts while supporting surface-mount assembly processes.
• Low-Voltage Core: 1.425–1.575 V supply range accommodates low-voltage system architectures for efficient power integration.
• Moderate Gate Count: Approximately 250,000 gates for implementing substantial logic functions without the overhead of larger devices.

Why Choose M1AFS250-1FG256I?

The M1AFS250-1FG256I positions itself as a practical, industrial-grade FPGA for designs that need a balance of logic resources, on-chip memory and a high I/O count in a compact package. Its specified operating temperature range and surface-mount LBGA package make it suitable for industrial and embedded applications where reliability and PCB density matter.

Designers and procurement teams looking for a mid-density programmable solution will find the M1AFS250-1FG256I appropriate for control, interface bridging and moderate signal-processing tasks, offering scalability through programmable logic and the long-term availability typically associated with Fusion® FPGA offerings.

Request a quote or submit an inquiry to check availability and pricing for the M1AFS250-1FG256I. Our team can provide lead-time information and assist with technical details for your design evaluation.