M1AFS250-2FG256I

The M1AFS250-2FG256I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, delivering a programmable logic fabric with 6,144 logic elements and 250,000 gates in a compact 256-LBGA package. It combines a sizeable I/O count and on-chip memory with industrial-grade temperature capability for designs that require programmable control and interfacing in demanding environments.

Designed for surface-mount assembly and RoHS compliance, this device targets industrial applications where reliable operation between −40 °C and 100 °C, a defined core supply range, and a balanced logic/memory resource mix are important design criteria.

Key Features

• Logic Capacity  6,144 logic elements (cells) and 250,000 gates provide the programmable resources to implement custom digital functions and glue logic.
• Embedded Memory  Approximately 0.037 Mbits of on-chip RAM (36,864 total RAM bits) for buffering, small LUT-based storage, and local data handling.
• I/O Count  114 user I/O pins to support a wide range of peripheral and interface connections on a single device.
• Power and Voltage  Core supply range specified from 1.425 V to 1.575 V, enabling predictable power provisioning and integration with low-voltage system rails.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet thermal requirements of industrial applications.
• Package and Mounting  256-LBGA package (supplier package: 256-FPBGA, 17×17 mm) in a surface-mount form factor for compact PCB layouts and automated assembly.
• Regulatory Status  RoHS compliant for environmental directive alignment in regulated markets.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature range and 114 I/O pins allow the FPGA to interface with sensors, actuators, and control networks in factory or process automation equipment.
• Embedded System Glue Logic  6,144 logic elements and 250,000 gates enable implementation of custom bus bridges, protocol conversion, and peripheral aggregation to consolidate discrete components.
• Data Acquisition and Signal Conditioning  On-chip RAM and numerous I/Os support buffering and pre-processing of digital sensor data ahead of a host processor.

Unique Advantages

• Compact, high-density packaging: The 256-LBGA (256-FPBGA, 17×17) surface-mount package reduces PCB footprint while delivering ample I/O and logic resources.
• Industrial-ready thermal performance: Qualified for −40 °C to 100 °C operation to maintain functionality in temperature-stressed installations.
• Balanced logic and memory resources: A combination of 6,144 logic elements and 36,864 RAM bits supports diverse embedded tasks without extensive external components.
• Predictable low-voltage core supply: Narrow core voltage window (1.425 V–1.575 V) simplifies power-supply design and ensures stable core operation.
• RoHS compliance: Facilitates deployment in regions and products requiring lead-free and environmentally compliant components.

Why Choose M1AFS250-2FG256I?

The M1AFS250-2FG256I positions itself as a programmable logic option for designers who need a combination of substantial logic capacity, a moderate amount of embedded memory, and a high I/O count in an industrial-grade, compact package. Its defined core voltage range and surface-mount 256-LBGA footprint make it suitable for space-conscious PCB designs that require reliable operation across a wide temperature span.

This FPGA is suited to engineers building industrial control, embedded interface, or data-acquisition systems who require a dependable, RoHS-compliant device from a recognized manufacturer and prefer a balanced on-chip resource mix for integration and reduced external component count.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the M1AFS250-2FG256I. Our team can provide procurement details and help evaluate this device for your specific design needs.