M1AFS250-2FGG256I

The M1AFS250-2FGG256I is a Fusion® field programmable gate array (FPGA) IC from Microchip Technology designed for industrial applications. It provides a moderate logic density with 6,144 logic elements and approximately 250,000 gates, combined with on-chip embedded memory and a broad I/O count for flexible system integration.

With a 256-pin BGA package and industrial temperature rating, this device targets embedded control, I/O consolidation, and other industrial designs that require programmable logic, compact packaging, and reliable operation across a wide temperature range.

Key Features

• Logic Capacity  6,144 logic elements supporting approximately 250,000 gates for implementing medium-density programmable logic designs.
• Embedded Memory  Approximately 0.037 Mbits of on-chip RAM (36,864 bits) suitable for small data buffering and state storage.
• I/O Resources  114 available I/O pins to support multiple peripheral interfaces and system-level signal routing.
• Package and Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board layouts.
• Power  Single supply operating range from 1.425 V to 1.575 V to match system power rail requirements.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for use in demanding environments.
• Regulatory  RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Industrial Control  Programmable logic for embedded controllers, PLC I/O expansion, and machine interface tasks that require reliable operation across industrial temperature ranges.
• Sensor and I/O Aggregation  Consolidation and preprocessing of multiple sensor inputs using available I/O and on-chip logic for deterministic signal handling.
• Protocol Bridging and Custom Interfaces  Implement custom interface logic or protocol conversion where a moderate number of I/Os and reprogrammable logic are required.

Unique Advantages

• Balanced Logic Density: 6,144 logic elements and ~250,000 gates provide sufficient capacity for medium-complexity designs without excessive board-level cost.
• Compact BGA Package: 256-LBGA (256-FPBGA, 17×17) enables high pin density in a small footprint, helping reduce PCB area for space-constrained systems.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in environments with wide temperature variation.
• Flexible I/O Count: 114 I/Os allow integration of multiple peripherals and signals, simplifying system architecture and reducing external components.
• Low-Voltage Core: Operates from 1.425 V to 1.575 V, aligning with low-voltage FPGA power domains used in many embedded systems.
• RoHS Compliant: Manufactured to meet RoHS requirements for use in lead-free production processes.

Why Choose M1AFS250-2FGG256I?

The M1AFS250-2FGG256I positions itself as a practical choice for industrial embedded designs that need reprogrammable logic, moderate memory, and a substantial I/O complement in a compact BGA package. Its combination of 6,144 logic elements, 114 I/Os, and industrial temperature rating makes it suitable for systems that require dependable, reconfigurable hardware without the complexity of higher-density devices.

Designed and manufactured by Microchip Technology, this Fusion® FPGA offers a balance of integration, reliability, and footprint efficiency for engineers building control, interface, and sensor aggregation solutions that demand stable performance in industrial environments.

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