M1AFS250-FG256I

The M1AFS250-FG256I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It delivers a configurable logic fabric with 6,144 logic elements, 250,000 gates and approximately 0.037 Mbits of embedded memory, packaged in a 256-ball LBGA for surface-mount assembly. With a wide operating temperature range and RoHS compliance, the device is suited to industrial control and embedded systems that require configurable logic and significant I/O density.

Key Features

• Core Logic  6,144 logic elements and 250,000 gates provide a flexible programmable fabric for custom logic implementation and parallel processing.
• Embedded Memory  Approximately 0.037 Mbits of on-chip RAM (36,864 total RAM bits) supports local buffering, small lookup tables and state storage.
• I/O Capacity  114 I/O pins enable interfacing to multiple peripherals, sensors and external devices in multi-channel designs.
• Power Supply  Operates from a core voltage supply range of 1.425 V–1.575 V, allowing predictable power design and voltage planning.
• Package & Mounting  256-LBGA (supplier device package: 256-FPBGA, 17×17 mm) in a surface-mount form factor for compact board integration.
• Operating Range  Industrial-grade operation from −40°C to 100°C to meet a wide range of environmental requirements.
• Environmental Compliance  RoHS compliant to support regulatory requirements for material composition.

Typical Applications

• Industrial Control  Configurable logic and substantial I/O make the device suitable for control algorithms, state machines and custom motor-control interfaces in industrial systems.
• Sensor & Data Aggregation  On-chip RAM and I/O density support sensor interfacing, data buffering and preprocessing before transfer to host processors.
• Communications & Protocol Bridging  Programmable fabric enables implementation of custom protocol handling and timing-sensitive I/O conversion tasks.

Unique Advantages

• Right-sized Logic Capacity: 6,144 logic elements and 250,000 gates provide enough programmable resources for mid-range custom logic without unnecessary overhead.
• Compact, Assembly-friendly Package: 256-LBGA (256-FPBGA, 17×17) surface-mount package simplifies board layout for space-constrained industrial designs.
• Industrial Temperature Range: Rated from −40°C to 100°C to support deployment in demanding ambient conditions.
• Predictable Power Envelope: Narrow core supply range (1.425 V–1.575 V) aids power supply selection and thermal planning.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and end-product compliance needs.
• Broad I/O Count: 114 I/Os allow flexible peripheral connectivity and multi-channel interfacing without external expander logic.

Why Choose M1AFS250-FG256I?

The M1AFS250-FG256I positions itself as an industrial-grade, mid-range FPGA solution that balances configurable logic capacity, I/O density and compact packaging. It is well suited for engineers and developers building industrial control systems, sensor interfaces, protocol bridges and other embedded applications that require reliable programmable logic and a predictable power and thermal profile.

Backed by Microchip Technology’s Fusion FPGA family, the device provides a clear upgrade path within a recognized FPGA product line, supporting long-term design stability and parts continuity for production deployments.

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