M1AFS250-FGG256I

The M1AFS250-FGG256I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a balanced mix of logic resources, on-chip memory, and I/O in a compact 256‑LBGA package aimed at industrial embedded designs.

With 6,144 logic elements, approximately 0.0369 Mbits of embedded memory and 114 general-purpose I/O, this device is designed for applications requiring moderate gate density, flexible interfacing and industrial temperature operation.

Key Features

• Core Logic  6,144 logic elements (CLBs) delivering a total of approximately 250,000 gates for custom logic implementation and control functions.
• Embedded Memory  36,864 bits of on-chip RAM — approximately 0.0369 Mbits — for small data buffers, FIFOs, and state storage.
• I/O Count  114 general-purpose I/Os to support multiple parallel interfaces, sensors, and control lines.
• Package & Mounting  256‑LBGA package (supplier device package: 256‑FPBGA, 17×17) with surface-mount mounting for compact board designs.
• Power Supply  Core voltage range of 1.425 V to 1.575 V for defined supply planning and power-tree design.
• Operating Temperature  Industrial temperature rating from −40 °C to 100 °C for hot and cold environment suitability.
• Environmental Compliance  RoHS compliant to support environmentally conscious assembly and manufacturing processes.

Unique Advantages

• Dense, configurable logic: 6,144 logic elements and ~250,000 gates enable implementation of custom control and processing functions without external ASICs.
• Integrated on-chip RAM: 36,864 bits of embedded memory simplify buffering and state retention for control logic and small data paths.
• Generous I/O availability: 114 I/Os provide flexibility for connecting multiple peripherals, sensors, and parallel interfaces.
• Compact BGA footprint: 256‑LBGA (17×17) offers a space-efficient package for dense board layouts and surface-mount assembly.
• Industrial temperature capability: Rated −40 °C to 100 °C for reliable operation across a wide range of environmental conditions.
• RoHS compliant: Supports modern environmental and manufacturing requirements.

Why Choose M1AFS250-FGG256I?

The M1AFS250-FGG256I positions itself as a practical, industrial-grade FPGA option that combines a moderate logic element count with on-chip memory and substantial I/O in a compact BGA package. Its defined core voltage window and industrial temperature rating help simplify power budgeting and thermal planning for embedded system designers.

This device is well suited to engineers and procurement teams looking for a configurable logic solution that provides integration, reliable operation across temperature extremes, and a small board footprint—backed by Microchip Technology’s product family and documentation.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the M1AFS250-FGG256I.