M1AFS600-1FG484

The M1AFS600-1FG484 is a Fusion® field programmable gate array (FPGA) from Microchip Technology, provided in a 484-ball FPBGA surface-mount package (23 × 23 mm). It delivers a commercial-grade programmable logic resource suitable for designs that require configurable logic, embedded memory, and a substantial I/O complement.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 172 I/O pins, this device targets commercial embedded systems and programmable logic applications that need a balance of logic capacity, on-chip memory and flexible I/O in a compact BGA package.

Key Features

• Logic Capacity  13,824 logic elements (cells) supporting up to 600,000 gates for mid-range programmable logic implementations.
• Embedded Memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM to support buffering, state storage and small embedded data sets.
• I/O Resources  172 general-purpose I/O pins to enable connectivity with peripherals, sensors and external logic.
• Power  Operates from a core supply in the range 1.425 V to 1.575 V, allowing designers to align power delivery to system requirements.
• Package and Mounting  484-FPBGA (23 × 23) surface-mount package (484-BGA) for high-density board integration and reliable soldered attachment.
• Operating Range and Grade  Commercial temperature rating from 0 °C to 85 °C, suitable for commercial-grade applications.
• Environmental Compliance  RoHS-compliant construction to meet common environmental and manufacturing standards.

Typical Applications

• Commercial Embedded Systems  Programmable logic for general-purpose embedded designs that require mid-range logic capacity and on-chip memory.
• Prototyping and Development Platforms  A versatile FPGA option for hardware prototyping and iterative design where reprogrammability and I/O flexibility are needed.
• Glue Logic and Interface Bridging  Use as configurable glue logic between system components, leveraging 172 I/Os to bridge multiple interfaces.

Unique Advantages

• Balanced Logic and Memory  13,824 logic elements combined with approximately 0.11 Mbits of embedded RAM provide a practical balance of programmable logic and on-chip storage for many commercial applications.
• Generous I/O Count  172 I/O pins enable broad connectivity options, reducing the need for external I/O expanders in many designs.
• Compact BGA Footprint  484-ball FPBGA (23 × 23) package offers a space-efficient solution for board layouts requiring higher I/O density.
• Commercial Temperature Suitability  Rated 0 °C to 85 °C for reliable operation in commercial environments.
• Regulatory Readiness  RoHS-compliant manufacturing supports common environmental and supply-chain requirements.

Why Choose M1AFS600-1FG484?

The M1AFS600-1FG484 positions itself as a commercially graded, mid-range FPGA that combines substantial logic resources, embedded RAM and a high I/O count in a compact 484-BGA package. It is well suited to designers and teams who need programmable logic for commercial embedded systems, prototyping, or interface bridging without moving to larger FPGA families.

Choosing this Fusion® FPGA provides a straightforward, verifiable specification set—logic element count, on-chip memory, I/O count, supply range, package and operating temperature—that supports predictable system integration and long-term design planning.

Request a quote or submit a procurement inquiry to receive pricing and availability for the M1AFS600-1FG484. Our team can provide ordering details and support documentation to help integrate this FPGA into your next commercial design.