M1AFS600-1FGG256I

The M1AFS600-1FGG256I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, provided in a 256-LBGA package. This industrial-grade FPGA integrates 13,824 logic elements and approximately 0.11 Mbits of embedded memory with 119 user I/Os, offering a balanced resource set for mid-sized programmable logic designs.

Designed for surface-mount applications, the device operates on a 1.425 V to 1.575 V supply and is specified for an operating temperature range from -40 °C to 100 °C, supporting deployment in industrial environments that require extended thermal tolerance.

Key Features

• Core Logic  13,824 logic elements (cells) providing flexible programmable logic capacity for custom digital functions and glue logic.
• Embedded Memory  110,592 total RAM bits—approximately 0.11 Mbits of on-chip embedded memory for buffering, small lookup tables, and state storage.
• I/O  119 user I/Os to support multiple peripheral interfaces and external device connections within a compact package.
• Gate Count  Approximately 600,000 gates suitable for mid-range logic integration needs.
• Package & Mounting  256-LBGA (supplier package: 256-FPBGA, 17 × 17) in a surface-mount form factor for board-level integration.
• Power  Specified operating supply range of 1.425 V to 1.575 V for predictable power planning.
• Temperature & Grade  Industrial grade with an operating temperature range of -40 °C to 100 °C for extended-environment applications.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Custom control logic and I/O interfacing in industrial automation systems that benefit from the device's industrial temperature rating and robust I/O count.
• Embedded Systems  Mid-sized embedded designs requiring programmable logic, on-chip memory, and a moderate gate count for glue logic or protocol bridging.
• Instrumentation  Measurement and instrumentation equipment that leverage programmable logic and available I/Os for signal conditioning, control, and data handling.

Unique Advantages

• Balanced Logic and Memory: Combines 13,824 logic elements with approximately 0.11 Mbits of embedded memory to support both control logic and modest data buffering without external RAM.
• Ample I/O Count: With 119 user I/Os, the device accommodates multiple peripherals and interface requirements while minimizing the need for additional I/O expanders.
• Industrial Temperature Range: Specified operation from -40 °C to 100 °C enables use in demanding environments where thermal resilience is required.
• Compact, Surface-Mount Package: The 256-LBGA (256-FPBGA, 17×17) package offers a compact footprint for space-constrained PCB layouts.
• Low-Voltage Operation: A defined supply range of 1.425 V to 1.575 V simplifies power-supply design for systems targeting low-voltage rails.
• Environmental Compliance: RoHS compliance supports regulatory and manufacturing requirements for electronic assemblies.

Why Choose M1AFS600-1FGG256I?

The M1AFS600-1FGG256I positions itself as a practical, industrial-grade FPGA option for engineers needing a mid-range programmable device with a solid mix of logic, memory, and I/O. Its 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 119 I/Os provide a versatile platform for custom digital functions within a compact 256-LBGA package.

This FPGA is suited to teams developing industrial automation, embedded control, and instrumentation products that require predictable low-voltage operation and extended temperature capability. The combination of resources and package choices delivers scalability and deployment readiness for production-focused designs.

Request a quote or submit an inquiry to get pricing and availability for the M1AFS600-1FGG256I and discuss how it fits your design requirements.