M1AFS600-1FGG484

The M1AFS600-1FGG484 is a Fusion® Field Programmable Gate Array (FPGA) in a 484-ball BGA package designed for surface-mount assembly. It provides 13,824 logic elements and 110,592 bits of on-chip RAM to implement glue logic, custom accelerators, and I/O-rich subsystems in commercial applications.

With 172 user I/O pins, a nominal supply window of 1.425 V to 1.575 V, and a 0 °C to 85 °C operating range, this device is suited to compact, board-level designs that require medium-density programmable logic and significant I/O flexibility.

Key Features

• Core Logic 13,824 logic elements provide programmable resources for implementing custom logic, state machines, and data-path functions.
• On-Chip Memory 110,592 bits of embedded RAM (approximately 0.11 Mbits) for FIFOs, buffers, and small on-chip data storage.
• I/O Capacity 172 user I/O pins to support multiple parallel interfaces and board-level connectivity options.
• Package & Mounting 484-ball FPBGA (484-BGA, 23 × 23 mm) in a surface-mount package for compact, high-density PCB layouts.
• Power Narrow supply requirement of 1.425 V to 1.575 V for core power, enabling predictable power design.
• Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operation.
• Regulatory Compliance RoHS-compliant for lead-free manufacturing and assembly processes.

Typical Applications

• Embedded Control — Implement custom control logic and state machines where moderate logic density and on-chip RAM are required.
• Communications Equipment — Use available I/O and logic elements to handle protocol bridging, framing, and interface adaptation.
• Consumer Electronics — Add configurable peripherals, user-interface control, or glue logic in compact, surface-mount board designs.
• Test & Measurement — Implement data buffering and deterministic control paths using on-chip RAM and programmable logic resources.

Unique Advantages

• Substantial Logic Capacity: 13,824 logic elements enable meaningful hardware acceleration and complex control implementations without external ASICs.
• Integrated On-Chip RAM: 110,592 bits of embedded RAM reduces the need for external memory for small buffers and FIFOs, simplifying board-level design.
• High I/O Count: 172 user I/Os support multiple parallel interfaces and peripheral connections, lowering the need for external multiplexers or expanders.
• Compact BGA Footprint: 484-FPBGA (23 × 23 mm) package allows high-density mounting and compact PCB layouts for space-constrained products.
• Predictable Power Design: Defined supply range (1.425 V–1.575 V) aids in power delivery planning and regulator selection.
• RoHS Compliance: Meets lead-free manufacturing requirements for modern electronics production.

Why Choose M1AFS600-1FGG484?

The M1AFS600-1FGG484 balances moderate logic density, on-chip memory, and a high I/O count in a compact 484-BGA surface-mount package, making it well suited for commercial designs that require flexible programmable logic and board-level integration. Its defined voltage range and commercial temperature rating provide predictable behavior for standard embedded and consumer systems.

This device is appropriate for engineers and procurement teams seeking a programmable logic device that offers substantial logic elements, embedded RAM, and extensive I/O in a RoHS-compliant BGA package for scalable, board-level implementations.

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