M1AFS600-2FG256I

The M1AFS600-2FG256I is a Fusion® Field Programmable Gate Array (FPGA) offered in a 256-ball LFBGA package. It provides a programmable fabric with 13,824 logic elements and approximately 0.11 Mbits of embedded memory, together with 119 user I/O pins for custom digital logic and interfacing tasks.

Designed and specified for industrial use, this device supports a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, making it suitable for robust embedded applications that require moderate on-chip logic, memory, and I/O integration.

Key Features

• Programmable Logic  13,824 logic elements (cells) providing flexible digital implementation capacity and support for a range of custom logic functions.
• Logic Density  Approximately 600,000 gates of equivalent logic capacity to support medium-complexity designs.
• On-Chip Memory  Approximately 0.11 Mbits of embedded RAM (110,592 total RAM bits) for data buffering, state storage, and small on-chip data structures.
• I/O Resources  119 user I/O pins to interface with peripherals, sensors, and external logic devices.
• Power Supply  Operates from a core supply voltage between 1.425 V and 1.575 V for consistent device operation within the specified range.
• Package & Mounting  Supplied in a 256-ball LBGA package (supplier package: 256-FPBGA, 17×17) and designed for surface-mount assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Industrial control systems  Use the device's 13,824 logic elements and 119 I/O pins for custom control logic, signal routing, and interfacing in industrial equipment.
• Embedded processing and glue logic  Implement custom state machines, protocol bridges, and interface logic using the device’s on-chip memory and programmable fabric.
• Communications and instrumentation  Leverage the device’s logic density and I/O count to implement medium-complexity protocol handling and data conditioning in instrumentation and communication modules.

Unique Advantages

• Balanced logic and memory capacity: 13,824 logic elements paired with approximately 0.11 Mbits of RAM enables compact implementations of control and data-path logic without external memory.
• Ample I/O for integration: 119 user I/Os facilitate direct connections to peripherals and sensors, reducing the need for additional interface components.
• Industrial-grade thermal range: Rated from −40 °C to 100 °C to support deployment in a wide range of industrial environments.
• Compact surface-mount package: 256-ball LBGA (256-FPBGA, 17×17) provides a high-density footprint for space-constrained boards while supporting standard surface-mount assembly.
• Narrow core-voltage window: Defined supply range (1.425 V to 1.575 V) that supports predictable power planning and design integration.
• Regulatory alignment: RoHS compliance supports use in designs that require restricted-substance conformity.

Why Choose M1AFS600-2FG256I?

The M1AFS600-2FG256I positions itself as a practical FPGA choice for engineers who need a mid-density programmable device with a balanced mix of logic, embedded memory, and I/O. Its specified industrial temperature range and RoHS compliance make it suitable for embedded and industrial projects that require reliable operation across a wide thermal envelope.

This device is well suited for designers implementing custom control logic, protocol interfaces, and moderate data-path processing where on-chip memory and a moderate number of I/Os reduce board-level complexity and component count.

Request a quote or submit an inquiry to get pricing and availability details for the M1AFS600-2FG256I. Our team can provide lead-time information and support for procurement and integration into your design.