M1AFS600-2FG484I

The M1AFS600-2FG484I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial applications. It offers a balanced combination of logic density, embedded memory, and I/O count in a compact 484-BGA package to support configurable digital functions in embedded systems.

With 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, 172 I/O pins, and support for a 1.425 V to 1.575 V supply, this device targets designs that require moderate gate density, flexible I/O, and operation across a broad industrial temperature range.

Key Features

• Core Logic 13,824 logic elements providing a total of 600,000 gates for implementing custom digital logic and control functions.
• Embedded Memory Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for data buffering, small lookup tables, and state storage.
• I/O Count 172 user I/O pins to support multiple parallel interfaces, sensor inputs, and peripheral connections.
• Power Operating core supply range of 1.425 V to 1.575 V to match system power rails and ensure stable core operation.
• Package and Mounting 484-BGA package (supplier device package: 484-FPBGA (23x23)) in a surface-mount form factor for compact board integration.
• Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environments.
• Compliance RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Industrial Control Implement real-time control logic and interface aggregation using the device’s logic elements and available I/O for PLCs, motor controllers, and factory automation modules.
• Communications and Networking Use the FPGA’s logic density and I/O count for protocol handling, packet processing, or custom interface bridging in industrial networking equipment.
• Embedded Systems and Instrumentation Deploy the FPGA for signal conditioning, data acquisition front-ends, or custom timing and control in test and measurement hardware.

Unique Advantages

• Compact, high-density logic: 13,824 logic elements and 600,000 gates provide substantial programmable capacity while minimizing PCB footprint.
• On-chip memory for local buffering: Approximately 0.11 Mbits of embedded RAM reduces external memory dependence for small data and state storage.
• Generous I/O provisioning: 172 I/O pins enable multiple parallel interfaces and flexible peripheral connectivity without complex multiplexing.
• Industrial temperature range: Rated for −40 °C to 100 °C operation to support deployment in harsh or temperature-variable environments.
• Surface-mount 484-BGA package: Enables dense board layouts and reliable soldered connections for production assembly.
• Regulatory compliance: RoHS compliance supports environmental requirements for commercial and industrial systems.

Why Choose M1AFS600-2FG484I?

The M1AFS600-2FG484I is positioned for engineers and procurement teams seeking an industrial-grade FPGA with a solid balance of programmable logic, embedded memory, and I/O capacity in a compact BGA package. Its specification set supports a wide range of embedded and industrial designs that require configurable logic, local buffering, and reliable operation across temperature extremes.

Backed by Microchip Technology, this Fusion® FPGA offers a practical option for designs that need scalable logic resources, a moderate amount of on-chip RAM, and extensive I/O in a surface-mount form factor—helping simplify BOMs and accelerate system integration.

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