M1AFS600-2FGG484I

The M1AFS600-2FGG484I is a Fusion® field programmable gate array (FPGA) from Microchip Technology supplied in a 484-BGA (23×23) surface-mount package. The device integrates 13,824 logic elements (cells), approximately 0.11 Mbits of on-chip RAM (110,592 total RAM bits) and a 172-pin I/O count, providing a balanced combination of logic capacity, embedded memory and I/O resources.

Designed for industrial-grade environments, the FPGA operates from a core supply range of 1.425 V to 1.575 V and across an operating temperature range of −40 °C to 100 °C, and is RoHS compliant.

Key Features

• Core Logic  13,824 logic elements (cells) and 600,000 gates provide mid-range programmable logic capacity for a variety of embedded designs.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for data buffering, state storage and small block memory needs.
• I/O Resources  172 user I/O pins to support multiple external interfaces and system connections within a single device.
• Package & Mounting  484-BGA, 23 × 23 FPBGA package in a surface-mount configuration for compact board-level integration.
• Power  Core voltage supply range of 1.425 V to 1.575 V to match system power rails and regulator designs.
• Temperature & Grade  Industrial-grade device rated for −40 °C to 100 °C operation to meet extended-environment requirements.
• Compliance  RoHS compliant for regulatory and environmental considerations.

Unique Advantages

• Balanced Logic and Memory Capacity: 13,824 logic elements paired with 110,592 bits of RAM supports a wide range of mid-density FPGA designs without oversizing the solution.
• Generous I/O Count: 172 I/O pins allow integration of multiple peripherals and interfaces directly to the FPGA, reducing external components.
• Industrial Temperature Range: Rated for −40 °C to 100 °C, enabling deployment in systems that require extended environmental tolerance.
• Compact BGA Packaging: 484-FPBGA (23×23) surface-mount package provides a high pin count in a space-efficient footprint for dense board layouts.
• Standards-Friendly Compliance: RoHS compliance simplifies material and environmental compliance for production.

Why Choose M1AFS600-2FGG484I?

The M1AFS600-2FGG484I Fusion® FPGA offers a practical combination of logic density, on-chip memory and I/O resources in a compact 484-BGA package, targeted at designs that require mid-range programmable logic with industrial operating capability. Its specified core voltage range and RoHS compliance make it suitable for controlled-power systems and regulated production environments.

This device is well suited for engineers and procurement teams seeking a field-programmable solution that balances integration, I/O flexibility and environmental robustness while maintaining a compact board footprint.

Request a quote or submit an RFQ to check pricing and availability for the M1AFS600-2FGG484I.