M1AFS600-FG256

The M1AFS600-FG256 is a Fusion® field programmable gate array (FPGA) from Microchip Technology, provided in a 256-LBGA surface-mount package. It offers a commercial-grade FPGA fabric with a balance of logic density, I/O capability and embedded RAM for a wide range of commercial embedded designs.

With 13,824 logic elements, approximately 110,592 bits of on-chip RAM and 119 I/Os, the device targets applications that require mid-range programmable logic capacity in a compact 256-ball package. It is RoHS compliant and operates over a single supply range of 1.425 V to 1.575 V with an ambient temperature rating of 0 °C to 85 °C.

Key Features

• Logic Capacity — 13,824 logic elements (CLBs) and approximately 600,000 gates provide mid-range programmable logic resources for combinational and sequential designs.
• On-chip Memory — Approximately 110,592 bits of embedded RAM enable local buffering, small FIFOs and configuration storage within the FPGA fabric.
• Flexible I/O — 119 user I/O pins to support multiple peripherals, interfaces and board-level interconnect requirements.
• Power Supply — Single-core voltage supply range of 1.425 V to 1.575 V for core operation.
• Package and Mounting — 256-LBGA (supplier device package: 256-FPBGA, 17 × 17 mm) in a surface-mount form factor for compact board integration.
• Commercial Grade and Temperature Range — Rated for commercial use with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Commercial Embedded Systems — Implement custom logic, protocol handling and control functions where mid-range logic capacity and on-chip RAM are required.
• Interface Bridging and Peripheral Control — Use available I/Os and programmable logic to aggregate, translate or buffer multiple peripheral interfaces on compact PCBs.
• Prototyping and OEM Solutions — Provide a development platform for designers who need reconfigurable logic and moderate embedded memory in a single-package solution.

Unique Advantages

• Balanced Logic and Memory — 13,824 logic elements combined with approximately 110,592 bits of RAM support both control-intensive and data-buffering functions without external memory for small to mid-size designs.
• High I/O Count in Compact Package — 119 I/Os in a 256-LBGA (17 × 17 mm) footprint enables dense connectivity while minimizing board area.
• Commercial Temperature and RoHS Compliance — Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for commercial product deployments and lead-free assembly processes.
• Single Supply Core Voltage — Narrow core voltage range (1.425 V–1.575 V) simplifies power budgeting for the FPGA core.
• Vendor Proven Platform — Fusion® FPGA architecture from Microchip Technology provides a known FPGA family for designs that require vendor support and documentation.

Why Choose M1AFS600-FG256?

The M1AFS600-FG256 positions itself as a commercial-grade, mid-density FPGA offering a practical mix of logic elements, embedded RAM and I/O in a compact 256-LBGA package. It is well suited to engineers and OEMs who need programmable logic for commercial embedded applications, interface bridging and compact system-level integration.

Choosing this Fusion® FPGA provides a scalable option within Microchip’s FPGA platform, delivering predictable electrical and thermal specifications (1.425 V–1.575 V core supply, 0 °C–85 °C ambient) and RoHS compliance for lead-free manufacturing. Its combination of logic resources, memory and I/O density makes it a viable option for designs requiring on-chip programmability without exceeding mid-range capacity limits.

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