M1AFS600-FG256I

The M1AFS600-FG256I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology offering a mid-range programmable logic resource set in a compact 256-LBGA package. With 13,824 logic elements and approximately 0.11 Mbits of embedded RAM, it targets industrial applications that require on-chip memory, flexible I/O, and a broad operating temperature range.

Designed for surface-mount deployment, the device combines a 600,000-gate architecture with 119 I/Os and a narrow core supply range to provide deterministic hardware resources for control, interfacing, and integration tasks in industrial systems.

Key Features

• Core Logic 13,824 logic elements (CLBs) delivering approximately 600,000 gates for implementing custom logic and data paths.
• Embedded Memory Approximately 0.11 Mbits (110,592 bits) of on-chip RAM to support buffering, state machines, and small data storage needs.
• I/O 119 general-purpose I/O pins to interface with sensors, actuators, and peripheral devices.
• Power Specified core supply range of 1.425 V to 1.575 V for controlled power delivery and predictable logic performance.
• Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17) optimized for surface-mount assembly and compact board layouts.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Compliance RoHS compliant for alignment with common environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation — Uses the industrial temperature range and flexible I/O set for sensor interfacing, control logic, and embedded timing functions.
• Embedded System Integration — Implements glue logic, protocol adaptation, or custom peripheral interfaces where on-chip RAM and logic density are required.
• Communications and Networking — Provides programmable data-paths and I/O connectivity for board-level protocol handling and signal routing.

Unique Advantages

• Balanced Logic Density: 13,824 logic elements and roughly 600,000 gates provide a practical mid-range capacity for many custom hardware tasks without excessive board-level complexity.
• On-Chip Memory: Approximately 0.11 Mbits of embedded RAM enables local buffering and state retention without external memory components.
• Generous I/O Count: 119 I/Os simplify direct interfacing to sensors, peripherals, and other digital devices, reducing the need for additional I/O expanders.
• Industrial Temperature Rating: Specified −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Compact, Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) allows high-density PCB integration while supporting automated assembly processes.
• Regulatory Alignment: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose M1AFS600-FG256I?

The M1AFS600-FG256I positions itself as a mid-range programmable solution combining a substantial logic element count, on-chip RAM, and a wide I/O complement within a compact industrial-grade package. It is suited to engineers who need a reliable, programmable device for industrial control, embedded integration, or communications tasks where temperature range, predictable supply requirements, and board-level density matter.

Choosing this Fusion® FPGA supports scalable design implementations that balance integration and board complexity, offering predictable electrical and environmental behavior backed by Microchip Technology’s product lineage.

Request a quote or submit an inquiry to evaluate M1AFS600-FG256I for your next design and to get pricing, availability, and ordering information.