M1AFS600-FG484

The M1AFS600-FG484 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology. It combines programmable logic with on-chip resources to support a range of embedded digital designs. With 13,824 logic elements, 172 I/O pins and approximately 0.11 Mbits of embedded memory, this commercial-grade device targets applications that require moderate logic capacity, flexible I/O and a compact 484-ball BGA package.

Key Features

• Logic Capacity — 13,824 logic elements providing a programmable fabric suitable for medium-complexity designs; approximately 600,000 equivalent gates.
• Embedded Memory — 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for data buffering, state storage and small lookup tables.
• I/O Count — 172 I/O pins to support multiple parallel interfaces and peripheral connections in a compact footprint.
• Power — Operates from a core voltage supply range of 1.425 V to 1.575 V, enabling predictable power-domain planning in your design.
• Package & Mounting — 484-BGA package case, supplier device package 484-FPBGA (23×23), designed for surface-mount assembly.
• Thermal / Grade — Commercial grade device with an operating temperature range of 0°C to 85°C for typical ambient environments.
• Standards — RoHS compliant for environmental and assembly compatibility.

Typical Applications

• Embedded Control — Implement custom control logic and state machines for appliances, instrumentation or consumer products that require configurable hardware behavior.
• Interface Bridging — Act as a flexible I/O hub to bridge differing peripheral interfaces or to implement custom protocol handling using available logic and I/O.
• Signal Processing — Provide medium-scale parallel processing and buffering for data aggregation, preprocessing or feature extraction tasks.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements combined with 110,592 bits of RAM delivers a practical balance of programmable logic and embedded memory for many mid-range designs.
• High I/O Density: 172 I/O pins enable multiple peripheral connections and flexible board-level partitioning without requiring larger packages.
• Compact BGA Package: 484-ball FPBGA (23×23) packaging offers a small PCB footprint for space-constrained applications while supporting surface-mount assembly processes.
• Predictable Power Envelope: Defined core supply range (1.425 V–1.575 V) aids in power supply selection and system-level integration.
• RoHS Compliant: Environmentally compliant manufacturing and assembly compatibility for modern production requirements.

Why Choose M1AFS600-FG484?

The M1AFS600-FG484 is positioned for engineers needing a commercial-grade Fusion® FPGA with a practical mix of logic, I/O and embedded memory in a compact BGA package. Its 13,824 logic elements, 172 I/O pins and on-chip RAM provide the resources to implement custom control, interface bridging and mid-level signal processing while maintaining a small PCB footprint.

This device is suitable for design teams focused on scalability within a product family and straightforward system integration, offering clear supply voltage and operating temperature specifications along with RoHS compliance for production readiness.

Request a quote or submit a purchase inquiry today to discuss availability, pricing and lead times for the M1AFS600-FG484.