M1AFS600-FGG256

The M1AFS600-FGG256 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for commercial applications. It integrates 13,824 logic elements and approximately 600,000 gates to deliver programmable logic capacity in a compact 256-ball L‑BGA package.

With 119 general-purpose I/O, roughly 0.1106 Mbits of embedded memory, and a 1.425–1.575 V core supply range, this surface-mount FPGA is suited for commercial embedded designs that require configurable logic, on-chip memory and moderate I/O density within a 17 × 17 mm package footprint.

Key Features

• Core Logic  13,824 logic elements (logic cells) providing programmable gate capacity for custom logic and control functions.
• Gate Count  Approximately 600,000 gates to support mid-range logic complexity and implementation density.
• Embedded Memory  Approximately 0.1106 Mbits of on-chip RAM (110,592 bits) for data buffering, state storage and small lookup tables.
• I/O  119 available I/Os to interface with peripherals, sensors and external devices.
• Package and Mounting  256-ball L‑BGA (supplier package: 256‑FPBGA, 17×17 mm) in a surface-mount form factor for compact board designs.
• Power  Core supply range 1.425 V to 1.575 V for system power planning and regulator selection.
• Operating Range and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Commercial embedded systems  Programmable logic for control, glue logic and protocol handling in commercial equipment operating within 0 °C to 85 °C.
• Interface bridging and I/O expansion  Use the 119 I/Os to consolidate and adapt peripheral interfaces on compact PCBs.
• Prototyping and development  Mid-range logic capacity and on-chip RAM support proof-of-concept and early-stage hardware validation for commercial products.

Unique Advantages

• Balanced logic and gate density: Provides 13,824 logic elements and ~600,000 gates for mid-range programmable designs without overprovisioning.
• Compact package: 256-ball L‑BGA (17×17 mm) enables space-efficient board layouts while maintaining significant logic and I/O resources.
• On-chip memory: Approximately 0.1106 Mbits of embedded RAM supports local buffering and state retention, reducing external memory needs for small data sets.
• Wide I/O count: 119 I/Os give designers flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant to meet common commercial manufacturing and deployment requirements.

Why Choose M1AFS600-FGG256?

The M1AFS600-FGG256 positions itself as a commercially graded Fusion® FPGA offering a practical combination of logic resources, on-chip memory and I/O for compact, programmable designs. Its 256-ball L‑BGA package and surface-mount mounting simplify integration into space-constrained PCBs while maintaining flexibility for a range of commercial embedded applications.

Designed and supplied by Microchip Technology, this part is appropriate for teams seeking a mid-range, commercially specified FPGA with verifiable electrical and thermal operating limits, straightforward power requirements and broad I/O availability to support a variety of development and product deployment scenarios.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the M1AFS600-FGG256.