M1AFS600-FG484K

The M1AFS600-FG484K is a Fusion® FPGA from Microchip Technology, offered in a 484-ball fine-pitch BGA package. It provides a programmable fabric with a substantial logic resource set, on-chip memory, and a significant I/O count for compact, rugged embedded designs.

Designed for use where wide temperature operation and military-grade qualification are required, this device targets applications that need deterministic, reconfigurable logic with the integration density of a BGA package and the voltage and thermal characteristics suitable for demanding environments.

Key Features

• Logic Capacity — 13,824 logic elements (cells) enabling complex programmable logic and custom digital functions within a single device.
• Gate Count — Approximately 600,000 gates to support medium-complexity system integration and custom processing tasks.
• On-Chip Memory — 110,592 total RAM bits (approximately 0.11 Mbits) of embedded memory for buffering, state storage, and small lookup tables.
• I/O Resources — 172 user I/O pins to interface with external peripherals, sensors, and system buses.
• Power Supply — Operates from a core voltage range of 1.425 V to 1.575 V for compatibility with low-voltage system architectures.
• Package & Mounting — 484-ball FPBGA (23 × 23) package in a surface-mount form factor for high-density board designs.
• Temperature & Grade — Military grade with an operating temperature range of −55 °C to 100 °C for use in harsh and rugged environments.
• Compliance — RoHS compliant.

Typical Applications

• Military & Defense systems — Implements mission-specific logic, protocol bridging, and I/O aggregation where military-grade components and wide temperature ranges are required.
• Rugged embedded controllers — Provides reconfigurable logic and on-chip memory for control, data handling, and timing functions in harsh-environment embedded equipment.
• High-density I/O processing — Supports systems that require numerous external interfaces and configurable logic to adapt signal routing and protocol handling.
• Custom digital acceleration — Offloads specific processing tasks to programmable logic to tailor performance and functionality without changing ASIC designs.

Unique Advantages

• Substantial programmable logic: 13,824 logic elements provide the capacity to implement complex state machines, custom datapaths, and control logic within a single FPGA.
• Integrated on-chip memory: 110,592 bits of embedded RAM reduce the need for external buffering and help lower board-level component count.
• High I/O count in a compact package: 172 I/Os in a 484-FPBGA (23 × 23) footprint enable dense system integration while minimizing PCB area.
• Military-grade temperature range: Rated from −55 °C to 100 °C to support deployment in thermally challenging and mission-critical environments.
• Tight core voltage specification: Operation from 1.425 V to 1.575 V supports predictable power sequencing and integration with low-voltage system rails.
• RoHS compliant: Meets lead-free and restricted-substance requirements for modern manufacturing processes.

Why Choose M1AFS600-FG484K?

The M1AFS600-FG484K positions itself as a rugged, mid-density Fusion® FPGA option for designers who require a balance of logic capacity, embedded memory, and a high I/O count in a compact BGA package. Its military grade and wide operating temperature range make it suitable for applications that demand reliability in challenging environments.

Backed by Microchip Technology, this device is suitable for development teams and procurement groups seeking a reconfigurable solution that consolidates discrete logic functions, reduces board-level complexity, and supports long-term deployment in rugged systems.

Request a quote or submit a procurement inquiry today to evaluate the M1AFS600-FG484K for your next rugged embedded design.