M1AFS600-FG484I

The M1AFS600-FG484I is a Fusion® field programmable gate array (FPGA) in a 484-ball BGA package designed for industrial applications. It delivers a programmable logic fabric with 13,824 logic elements and approximately 0.11 Mbits of embedded memory, along with 172 user I/O pins to support complex custom logic and I/O consolidation.

With a supply voltage range of 1.425 V to 1.575 V and an operating temperature range from −40 °C to 100 °C, this surface-mount FPGA targets designs that require robust thermal performance and industrial-grade reliability while remaining compact in a 23 × 23 mm 484-FPBGA footprint.

Key Features

• Core Logic  13,824 logic elements provide the programmable resources needed for custom digital functions and moderate-complexity logic designs.
• Embedded Memory  Total on-chip RAM of 110,592 bits, approximately 0.11 Mbits of embedded memory, for buffering, state storage, and small data tables.
• Gate Capacity  Approximately 600,000 gates to support aggregated logic and glue functions within a single device.
• I/O  172 user I/O pins to accommodate external interfaces, sensors, and peripheral connections in system designs.
• Power  Nominal supply range of 1.425 V to 1.575 V to align with system power envelopes and core-voltage requirements.
• Package & Mounting  484-ball FPBGA (23 × 23 mm) surface-mount package (484-BGA) for compact PCB implementation and high-density routing.
• Industrial Temperature Range  Rated to operate from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control  Custom logic, input/output aggregation and protocol bridging in industrial automation systems, benefiting from the device’s 172 I/O and −40 °C to 100 °C operating range.
• Communications Interfaces  Implementation of bespoke interface logic and glue functions where moderate logic density (13,824 logic elements) and on-chip memory are required.
• Embedded Systems  Integration of control and timing functions within compact boards using the 484-FPBGA package for space-constrained designs.

Unique Advantages

• Balanced Logic and Memory:  13,824 logic elements combined with approximately 0.11 Mbits of embedded RAM support a wide range of custom logic and buffering tasks without external memory dependency.
• High I/O Count:  172 user I/O pins simplify system integration by reducing the need for external multiplexing or additional interface chips.
• Industrial Robustness:  An operating range from −40 °C to 100 °C makes the device suitable for industrial environments that demand thermal resilience.
• Compact, Surface-Mount Packaging:  484-FPBGA (23×23 mm) packaging enables high-density PCB layouts while maintaining manufacturability through standard surface-mount assembly.
• Controlled Core Power:  A defined supply window (1.425 V–1.575 V) simplifies power-supply design and ensures consistent core operation.
• RoHS Compliance:  Meets RoHS environmental requirements for modern electronics manufacturing processes.

Why Choose M1AFS600-FG484I?

The M1AFS600-FG484I offers a practical combination of programmable logic density, embedded memory, and a high I/O count in a compact 484-FPBGA package. Its industrial temperature rating and RoHS compliance make it a fit for demanding embedded and industrial control applications where consolidation of logic and interface functions reduces board complexity and BOM count.

This FPGA is well-suited for engineers and procurement teams seeking a reliable, mid-density programmable device that supports custom logic, protocol bridging, and I/O-heavy designs while providing predictable power and thermal characteristics.

Request a quote or contact sales to discuss availability, pricing, and how M1AFS600-FG484I can fit into your next design.