M1AFS600-FGG256K

The M1AFS600-FGG256K is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for military-grade, extended-temperature deployments. It provides a programmable digital fabric with 13,824 logic elements and approximately 110,592 bits of on-chip RAM for implementing custom digital functions.

With 119 user I/O pins, a 256-ball FBGA package, and a supply voltage window of 1.425 V to 1.575 V, this device targets applications that require configurable logic, embedded memory, and reliable operation across –55°C to 100°C.

Key Features

• Logic Capacity  13,824 logic elements and 600,000 gates provide a substantial programmable fabric for combinational and sequential logic implementations.
• Embedded Memory  110,592 bits of on-chip RAM (approximately 0.11 Mbits) for data buffering, small FIFOs, and configuration storage.
• I/O  119 user I/O pins to support multiple interfaces and peripheral connections.
• Power  Operates from a core supply range of 1.425 V to 1.575 V to match system power-rail requirements.
• Package & Mounting  256-LBGA (supplier package: 256-FPBGA (17×17)) in a surface-mount footprint for compact PCB integration.
• Temperature & Grade  Military-grade device rated for operation from –55°C to 100°C for use in harsh and temperature-extreme environments.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Military & Defense Systems  Implement custom control, protocol bridging, or signal-processing logic where military-grade components and wide temperature operation are required.
• Embedded Control  Replace fixed-function logic with reprogrammable logic to implement device control, monitoring, and sequencing functions.
• Communications & I/O Bridging  Use the device’s logic and I/O resources to create protocol translators, interface adaptors, or timing-control blocks.

Unique Advantages

• High Logic Density: 13,824 logic elements and 600,000 gates give designers headroom for complex logic implementations.
• On-Chip Memory: 110,592 bits of embedded RAM provide local storage for buffering and temporary data without external memory.
• Extended Temperature Capability: Rated for –55°C to 100°C to meet the demands of temperature-extreme deployments.
• Military Grade: Supplied as a military-grade device for designs requiring higher qualification levels.
• Compact, Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) enables dense PCB layouts and reliable board-level mounting.
• RoHS Compliant: Meets environmental compliance for modern manufacturing processes.

Why Choose M1AFS600-FGG256K?

The M1AFS600-FGG256K combines a substantial programmable logic fabric with embedded RAM, a broad I/O complement, and military-grade operating range to support reliable, reconfigurable designs in demanding environments. Its 256-ball FBGA package and surface-mount mounting make it suitable for compact systems that require rugged components and on-board programmability.

Designed and manufactured by Microchip Technology, this FPGA is appropriate for engineering teams developing military, defense, and other temperature-sensitive embedded applications that need configurable logic, localized memory, and long-term availability.

Request a quote or submit an inquiry to obtain pricing and availability for the M1AFS600-FGG256K.