M1AFS600-FGG484K

The M1AFS600-FGG484K is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for military-grade embedded applications. It combines a mid-range logic capacity with on-chip memory and a broad I/O count to support complex system integration in compact surface-mount packaging.

Key value comes from its 13,824 logic elements, approximately 0.11 Mbits of embedded memory, 172 I/O pins, and operation across a wide temperature range (−55°C to 100°C), enabling deployment in temperature-demanding environments where reliability and compact footprint matter.

Key Features

• Logic Capacity  13,824 logic elements (approximate grouping), providing a balanced resource set for mid-density programmable logic implementations.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 total RAM bits) to store configuration data, buffers, and small data structures without external memory.
• Gate Count  600,000 gates to support combinational and sequential logic needed for custom datapaths and control logic.
• I/O Resources  172 I/O pins suitable for multi-interface connectivity and direct peripheral interfacing in compact systems.
• Power  Core voltage supply range of 1.425 V to 1.575 V, enabling stable operation within specified supply margins.
• Package & Mounting  484-BGA package (484-FPBGA, 23 × 23) in a surface-mount form factor for space-efficient board integration.
• Temperature & Grade  Military grade with an operating temperature range of −55°C to 100°C for use in thermally challenging environments.
• Compliance  RoHS compliant, meeting requirements for restriction of hazardous substances.

Typical Applications

• Defense & Military Systems  Suitable for ruggedized control, signal processing, and interface logic where military-grade temperature performance is required.
• Aerospace Electronics  Useful for compact avionics modules that require a combination of logic resources, on-chip RAM, and numerous I/Os in a small BGA footprint.
• Rugged Communications Equipment  Can implement custom protocol handling, data buffering, and interface bridging in harsh temperature environments.

Unique Advantages

• Balanced Logic and Memory  13,824 logic elements paired with approximately 0.11 Mbits of embedded RAM provide a practical mix for control logic, state machines, and modest data buffering without external memory.
• High I/O Count  172 I/Os enable direct connection to multiple peripherals and interfaces, reducing the need for additional interface components.
• Rugged Operating Range  Military-grade rating and −55°C to 100°C operation support deployment in environments with wide temperature swings.
• Compact Surface-Mount Package  484-BGA (23 × 23) packaging offers a small board footprint for space-constrained designs while maintaining ample connections.
• Controlled Core Supply  Narrow core voltage range (1.425 V to 1.575 V) helps ensure consistent performance when integrated with regulated power systems.
• RoHS Compliance  Conforms to RoHS requirements for environmentally conscious manufacturing and deployment.

Why Choose M1AFS600-FGG484K?

The M1AFS600-FGG484K positions itself as a compact, military-grade FPGA option that balances logic density, embedded memory, and I/O count for rugged embedded designs. Its 13,824 logic elements, 172 I/Os, and approximately 0.11 Mbits of on-chip RAM make it suitable for engineers building mid-density programmable solutions where board space and temperature resilience are critical.

Designed for applications that demand reliable operation across extreme temperatures and a compact BGA footprint, this Fusion® FPGA offers a combination of integration and robustness that supports long-term deployment in defense, aerospace, and other temperature-challenging environments.

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