M1AFS600-FGG484I

The M1AFS600-FGG484I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 484-ball BGA package. It provides a moderate-density programmable logic fabric with integrated on-chip RAM and a substantial I/O count for industrial applications.

Designed for industrial-grade systems, this device combines 13,824 logic elements, approximately 110,592 bits of embedded memory, and 172 I/O pins in a surface-mount 484-FPBGA (23×23) package. Its specified operating range and supply voltage make it suitable for designs that require reliable operation across standard industrial temperatures.

Key Features

• Programmable Logic Density  13,824 logic elements (cells) and an estimated 600,000 gates provide the configurable fabric needed for medium-complexity logic integration.
• On-Chip Memory  Approximately 110,592 bits of embedded RAM to support buffering, FIFOs, and small data storage blocks without external memory.
• I/O Capacity  172 I/O pins to support extensive peripheral interfacing and board-level signal routing in I/O-rich applications.
• Package and Mounting  484-BGA (supplier package: 484-FPBGA, 23×23) surface-mount package for compact board designs and robust soldered connections.
• Power Supply  Specified supply voltage range of 1.425 V to 1.575 V for core power planning and regulator selection.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use the FPGA for logic control, I/O expansion and deterministic processing where industrial temperature capability is required.
• Embedded Systems  Integrate custom peripherals, protocol handling, and glue logic in compact embedded designs that benefit from on-chip RAM and high I/O counts.
• I/O-Intensive Interfaces  Implement parallel interfaces, bus bridging, or multi-channel I/O aggregation using the device's 172 available I/O pins.
• Prototyping and Custom Logic  Develop and validate medium-complexity digital functions or system-level prototypes leveraging the 13,824 logic elements and on-chip memory.

Unique Advantages

• Balanced Logic and Memory:  13,824 logic elements paired with approximately 110,592 bits of RAM enable integration of control logic and local data storage without immediate reliance on external memory.
• High I/O Count:  172 I/O pins provide flexibility to connect multiple peripherals and interface buses directly to the FPGA, reducing external glue logic.
• Industrial Reliability:  With an operating range from −40 °C to 100 °C and RoHS compliance, the device is suited for industrial deployments and standard environmental requirements.
• Compact Packaging:  The 484-FPBGA (23×23) surface-mount package supports dense board layouts while maintaining soldered connection reliability.
• Predictable Power Planning:  A defined core voltage window (1.425 V to 1.575 V) simplifies regulator selection and power-supply design.

Why Choose M1AFS600-FGG484I?

The M1AFS600-FGG484I positions itself as a practical choice for industrial-grade designs that require a moderate level of programmable logic, on-chip memory, and substantial I/O capacity in a compact BGA footprint. Its combination of 13,824 logic elements, approximately 110,592 bits of embedded RAM, and 172 I/O pins supports integration of custom logic, interface consolidation, and embedded system functions.

Manufactured by Microchip Technology and supplied in a 484-FPBGA (23×23) package, this FPGA is suited to engineers and procurement teams building industrial control, embedded, and I/O-focused systems that demand reliable operation across standard industrial temperature ranges.

Request a quote or submit an inquiry for pricing and availability of the M1AFS600-FGG484I to move your design forward.