M1AFS600-FGG256I

The M1AFS600-FGG256I is a Fusion® field programmable gate array (FPGA) from Microchip Technology designed for configurable digital logic in industrial environments. It provides a balance of logic capacity, on-chip embedded memory and a substantial I/O count in a compact 256-LBGA package.

With 13,824 logic elements and approximately 0.11 Mbits of embedded memory, this device suits designs that require mid-density programmable logic, flexible interfacing and operation across a wide industrial temperature range.

Key Features

• Logic Capacity  Approximately 13,824 logic elements (cells) to implement custom digital functions and state machines.
• Embedded Memory  Approximately 110,592 bits of on-chip RAM for buffering, FIFOs and small lookup tables.
• I/O Density  Up to 119 general-purpose I/O pins to support multiple peripheral connections and external interfaces.
• Operating Voltage  Core supply range from 1.425 V to 1.575 V for predictable power planning.
• Package and Mounting  256-LBGA (supplier device package: 256-FPBGA 17×17) in a surface-mount form factor for compact board layouts.
• Temperature Range  Industrial-grade operation from −40 °C to 100 °C for deployments in demanding environments.
• Gate Count  Approximately 600,000 gates to indicate implementation scale and design partitioning.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• Industrial Control  Custom logic for automation, sensor aggregation and control systems that benefit from a broad operating temperature range and flexible I/O.
• Protocol Bridging and Interface Conversion  Implement protocol translation and interface glue logic using available logic elements and I/O resources.
• Embedded System Acceleration  Offload deterministic tasks and specialized data paths to the FPGA fabric to reduce load on main processors.
• Test & Measurement  Use on-chip memory and reconfigurable logic for data capture, buffering and real-time signal processing in industrial test equipment.

Unique Advantages

• Mid-density logic capacity: 13,824 logic elements provide a practical balance between integration and board-level modularity, enabling substantial custom logic without overly large devices.
• On-chip RAM for buffering: Approximately 110,592 bits of embedded memory support local data storage for FIFOs, temporary registers and small lookup tables, reducing external memory needs.
• High I/O count: 119 I/O pins allow flexible interfacing to sensors, actuators, peripherals and communication links without complex external expanders.
• Industrial temperature rating: Rated from −40 °C to 100 °C to support deployments in harsh or variable environments.
• Compact, board-friendly package: 256-LBGA (17 × 17) surface-mount package enables dense PCB integration while maintaining robust signal routing options.
• Predictable power planning: Defined core voltage range (1.425 V to 1.575 V) simplifies power-supply design and sequencing.

Why Choose M1AFS600-FGG256I?

The M1AFS600-FGG256I offers a practical blend of programmable logic, embedded memory and I/O resources tailored for industrial applications that demand reliable, reconfigurable digital logic. Its specification set supports designers who need mid-range logic capacity with predictable power and thermal behavior.

Ideal for engineers developing embedded systems, industrial controllers and interface-rich products, this Fusion® FPGA delivers scalability and robustness backed by Microchip Technology. Its compact package and industrial temperature rating support long-term deployment in diverse environments.

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